研究了热-剪切循环条件下Sn-3.5Ag-0.5Cu钎料/Cu界面的显微结构,分析了界面金属间化合物的生长行为,并与恒温时效后的Sn-3.5Ag-0.5Cu/Cu界面进行了对比.结果表明:恒温时效至100 h,Sn-3.5Ag-0.5Cu/Cu界面上已形成Cu6Sn5和Cu3Sn两层金属间化合物;而热-剪切循环至720周Sn-3.5Ag-0.5Cu/Cu界面上只存在Cu6Sn5金属间化合物层,无Cu3Sn层生成,在界面近域的钎料内,颗粒状的Ag3Sn聚集长大成块状;在热-剪切循环和恒温时效过程中,界面金属间化合物的形态初始都为扇贝状,随着时效时间的延长逐渐趋于平缓,最终以层状形式生长.
参考文献
| [1] | 刘晓波,王国勇.Sn-Ag系电子无铅软钎料的超电势研究[J].电子工艺技术,2002(01):7-9. |
| [2] | He M;Lau WH;Qi GJ;Chen Z .Intermetallic compound formation between Sn-3.5Ag solder and Ni-based metallization during liquid state reaction[J].Thin Solid Films: An International Journal on the Science and Technology of Thin and Thick Films,2004(0):376-383. |
| [3] | Zeng K.;Tu KN. .Six cases of reliability study of Pb-free solder joints in electronic packaging technology [Review][J].Materials Science & Engineering, R. Reports: A Review Journal,2002(2):55-105. |
| [4] | Pang JHL;Low TH;Xiong BS;Xu LH;Neo CC .Thermal cycling aging effects on Sn-Ag-Cu solder joint microstructure, IMC and strength[J].Thin Solid Films: An International Journal on the Science and Technology of Thin and Thick Films,2004(0):370-375. |
| [5] | 赵跃,杜昆,胡咏珍.无铅软钎料的研究[J].广东有色金属学报,1998(02):99. |
| [6] | K. H. PRAKASH;T. SRITHARAN .INTERFACE REACTION BETWEEN COPPER AND MOLTEN TIN-LEAD SOLDERS[J].Acta materialia,2001(13):2481-2489. |
| [7] | 黄明亮,于大全,王来,王富岗.Sn-6Bi-2Ag（Cu, Sb）无铅钎料合金微观组织分析[J].中国有色金属学报,2002(03):486-490. |
| [8] | 许天旱,赵麦群,刘新华.Sn-Ag-Cu系无铅焊锡成分的优化研究[J].电子元件与材料,2004(08):14-16,21. |
| [9] | Luo W C;Kao C R.Liquid/solid and solid/solid reactions between SnAgCu lead-free solders and Ni surface finish[A].Piscataway,NJ:IEEE,2002:330-334. |
| [10] | 戚琳,赵杰,王来,杨富华,尹松鹤.波峰焊及再流焊无铅焊点组织演变规律的研究[J].电子工艺技术,2004(02):64-67. |
| [11] | QI Lin;ZHAO Jie;WANG Xiu-min.The effect of Bi on the IMC growth in Sn-3Ag-0.5Cu solder interface during aging process[A].上海:Institute of Electrical and Electronics Engineering Inc,2004:42-46. |
| [12] | Yoon JW;Jung SB .Effect of isothermal aging on intermetallic compound layer growth at the interface between Sn-3.5Ag-0.75Cu solder and Cu substrate[J].Journal of Materials Science,2004(13):4211-4217. |
| [13] | 肖克来提,杜黎光,孙志国,盛玫,罗乐.SnAgCu表面贴装焊点在时效和热循环过程中的组织及剪切强度变化[J].金属学报,2001(04):439-444. |
| [14] | Paul T.Vianco;Jerome A.Rejent;Paul F.Hlava .Solid-State Intermetallic Compound Layer Growth Between Copper and 95.5Sn-3.9Ag-0.6Cu Solder[J].Journal of Electronic Materials,2004(9):991-1004. |
| [15] | Shawkret Ahat;Mei Sheng;Le Luo .Effects of static thermal aging and thermal cycling on the microstructure and shear strength of Sn_(95.5)Ag_(3.8)Cu_(0.7) solder joints[J].Journal of Materials Research,2001(10):2914-2921. |
| [16] | K. S. Kim;S. H. Huh;K. Suganuma .Effects of intermetallic compounds on properties of Sn-Ag-Cu lead-free soldered joints[J].Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics,2003(1/2):226-236. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%