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以水玻璃为硅源,在酸性条件下,通过溶胶凝胶的方法,经去离子水洗去钠离子,然后溶剂交换,用三甲基氯硅烷进行表面修饰,在常压下干燥,制备成20~50nm孔径的介孔材料.

参考文献

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