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为了能够利用YAG优异的性能开发出更多的功能材料,通过调整无压烧结技术工艺参数成功制备YAG多孔陶瓷材料.结果表明:1500℃烧结的YAG多孔陶瓷的气孔率与1550℃烧结的陶瓷相近,但是1550℃制备的陶瓷具有较多烧结颈使抗压强度较高.保温2h的样品与保温1h的样品进行对比表明,保温2h样品包裹气泡长大使气孔率高,液相较多颗粒联接牢固使抗压强度高.升温速度为5℃/min制备的陶瓷比升温方式10℃/min制备的陶瓷气孔率和抗压强度都高.在800℃排碳所制备的样品的气孔率和抗压强度都比1000℃排碳的高.通过分析工艺参数与性能之间的内在联系,得出烧结温度为1550℃,保温2h,升温速度为5℃/min,800℃排碳时间1h制备的YAG多孔陶瓷材料较为适合,其材料气孔率为59.4%,抗压强度为8.55 MPa.

参考文献

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