本文研究了Sialon陶瓷与40Cr钢活性钎焊连接中缓冲层的作用.结果发现:缓冲层材料本身可能影响活性钎料与陶瓷的界面连接强度,对Ag_(57) Cu_(38) Ti_5活性钎料,Cu和Ta是较好的缓冲层材料,而对 Kovar,Ni-15 Cr-15Co则较差;用软性缓冲层如 Cu来松弛应比用硬性缓冲层如Mo来避免应力更加重要;软性缓冲层有一个合适的厚度范围,其h/L≈0.02—0.1;采用软/硬复合缓冲层可以有效的提高接头强度。最后作者提出了设计梯度材料作为专用缓冲层材料的设想。
The buffer layer material itself may be influential to the bond strength between active brazing filler and ceramics. For Ag_(57)Cu_(38)Ti_5 filler metal, Cu or Ta is excellent buffer layer material, but Kovar or Ni-15Cr-15Co is worse. It was important to design a layer of soft buffer, such as Cu, to relax interfacial stress rather than hard buffer layer, such as Mo, to avoid stress. There is an optimum thickness range of soft buffer layer, saying h/L=0.02-0.1. It was a good solution to the interfacial stress problem to use soft/bard buffer layer to increase metal/ceramics joint strength. Finally, an idea of designing gradual materials as buffer layer between metal and ceramics was suggested.
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