无铅镀层表面的锡须形貌、测量和风险评估

材料导报, 2008, 22(12): 110-112.

无铅镀层表面的锡须形貌、测量和风险评估

陆裕东 ^1, , 何小琦 ^2, , 恩云飞 ^3, , 王歆 ^4, , 庄志强 ^5,

1.信息产业部电子第五研究所电子元器件可靠性物理及其应用技术国家级重点实验室,广州,510610;华南理工大学材料学院特种功能材料教育部重点实验室,广州,510640

2.信息产业部电子第五研究所电子元器件可靠性物理及其应用技术国家级重点实验室,广州,510610

3.信息产业部电子第五研究所电子元器件可靠性物理及其应用技术国家级重点实验室,广州,510610

4.华南理工大学材料学院特种功能材料教育部重点实验室,广州,510640

5.华南理工大学材料学院特种功能材料教育部重点实验室,广州,510640

基金项目: 总装备部预研项目(51323060305) 信息产业部电子第五研究所科技发展基金(XF0726130)

关键词：锡须 , 镀层 , 互连 , 可靠性

Microstructure, Measurement and Risk Evaluation of Whisker in Lead-free Coating

在25℃H50%的常温常湿条件下,对纯Sn镀层引脚的锡须生长进行了评估.无铅化纯锡镀层表面的锡须呈现针状、圆柱状、小丘状、束状等多种不同显微形貌.外界环境与锡须的生长形貌无关,锡须生长部位特定的材料内部应力条件和晶体缺陷环境是决定晶须形貌的主要因素.经过500 h的常态老化,镀层上短晶须占多数,只发现了极少量长度超过50μm的锡须,而正是这少量的长晶须是造成铜互连引线间锡须桥连短路的主要因素.抑制少量超长的针状晶须的生长是防止晶须生长风险的关键.

参考文献

[1]	Tong Fang;Sony Mathew;Michael Osterman;Michael Pecht .Assessing Tin Whisker Risk in Electronic Products[J].Surface mount technology,2006(5):24-25.
[2]	Fukuda Y.;Osterman M.;Pecht M. .The Effect of Annealing on Tin Whisker Growth[J].IEEE transactions on electronics packaging manufacturing: A publication of the IEEE Components, Packaging, and Manufacturing Technology Society,2006(4):252-258.
[3]	Yuki Fukuda;Michael Osterman;Michael Pecht .The impact of electrical current, mechanical bending, and thermal annealing on tin whisker growth[J].Microelectronics and reliability,2007(1):88-92.
[4]	Fang T;Osterman M;Peeht M .Statistical analysis of tin whisker growth[J].Mieroelectronics Reliability,2006,46(5-6):846.
[5]	Choi W J;Galyon G;Tu K N.Hand book of lead-free solder technology for microelectronic assemblies[M].New York,USA:Marcel Dekker,Inc,2004:851.
[6]	Sheng G T T;Hu C F;Choi W J et al.Tin whiskers studied by focused ion beam imaging and transmission electron microscopy[J].Journal of Applied Physics,2004,92(01):64.
[7]	W. J. Choi;T. Y. Lee;K. N. Tu .Tin whiskers studied by synchrotron radiation scanning X-ray micro-diffraction[J].Acta materialia,2003(20):6253-6261.
[8]	Barsoum M W;Hoffman E N;Doherty R D et al.Driving force and mechanism for spontaneous metal whisker formation[J].Physical Review Letters,2004,93(206104):1.
[9]	K. N. Tu;A. M. Gusak;M. Li .Physics and materials challenges for lead-free solders[J].Journal of Applied Physics,2003(3):1335-1353.
[10]	TU K N;Li J C M .Spontaneous whisker growth on leadfree solder finishes[J].Materials Science and Engineering A:Structural Materials Properties Microstructure and Processing,2005,409(1-2):131.
[11]	Choi W J;Lee T Y;Tu K N.Structure and kinetics of Sn whisker growth on Pb-free solder finish[A].,2002:628.
[12]	Tu K N;Chen C et al.Stress analysis of spontaneous Sn whisker growth[J].Journal of Materials Science:Materials in Electronics,2007,18:269.

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