对冷拉拔铜锡合金导线显微组织的分子动力学模拟

机械工程材料, 2012, 36(11): 88-101.

对冷拉拔铜锡合金导线显微组织的分子动力学模拟

陈守东 ^1, , 陈敬超 ^2, , 封皓 ^3, , 杨运川 ^4,

1.昆明理工大学稀贵及有色金属先进材料教育部重点实验室,云南省新材料制备与加工重点实验室,昆明650093

2.昆明理工大学稀贵及有色金属先进材料教育部重点实验室,云南省新材料制备与加工重点实验室,昆明650093

3.昆明理工大学稀贵及有色金属先进材料教育部重点实验室,云南省新材料制备与加工重点实验室,昆明650093

4.贵阳铝镁设计研究院,贵阳550004

基金项目: 云南省自然科学基金资助项目(2008CD087) 云南省创新团队资助项目(2009C1003) 国家自然科学联合基金资助项目(u0837601) 国家自然科学基金资助项目(50874054)

关键词：铜锡合金导线 , 分子动力学 , 径向分布函数 , 均方根位移 , 显微组织

Molecular Dynamics Simulation for Microstructure of Cold-Drawn Cu-Sn Alloy Conductor

Keywords： Cu-Sn alloy conductor , molecular dynamics , radial distribution function , mean square displacement , microstructure

利用等温等体积的分子动力（NTV-MD）及均方根位移和径向分布函数研究了铜锡合金中的锡在铜基体中的存在形式和分布，并进行了试验验证。结果表明：锡以固溶的形式分布于铜基体中，有可能形成铜锡中间相Cu。Sn。，但锡在铜基体中没有发生团聚现象；试验结果验证了分子动力学模拟的准确性。

By means of constant temperature and constant volume molecular dynamics, square displacement and radial distribution function, the microstructure, existence form and distribution of Sn in Cu substrate were studied, and the experimental test was performed. The results show that Sn solid soluted in Cu substrate and probably formed to intermediate phase of Cu6 Sn5, but the agglomerate phenomena for Sn in Cu substrate had no appeared. The accuracy of the model dynamics simulation were tested by the experimental results.

参考文献

[1]	赵大军,高鹏,谢卉.高速电气化铁路电力机车接触线用铜合金线坯的开发[J].有色金属加工,2010(02):8-12.
[2]	孙贺明,白照印,宋海洋,张国香.Cu表面生长Ag薄膜过程的分子动力学模拟[J].北京理工大学学报,2005(09):831-834.
[3]	Aniya M;Shimojo F .Atomic structure and bonding properties in amorphous Cu-x(As2S3)(1-x) by ab initio molecular-dynamics simulations[J].Journal of Non-Crystalline Solids: A Journal Devoted to Oxide, Halide, Chalcogenide and Metallic Glasses, Amorphous Semiconductors, Non-Crystalline Films, Glass-Ceramics and Glassy Composites,2006(9/20):1510-1513.
[4]	HOU JiXin,SUN JianJun,ZHAN ChengWei,TIAN XueLei,CHEN XiChen.The structural change of Cu-Sn melt[J].中国科学G辑（英文版）,2007(04):414-420.
[5]	TANG Wen-ming,HE An-qiang,LIU Qi,D. G. IVEY.Solid state interfacial reactions in electrodeposited Cu/Sn couples[J].中国有色金属学报（英文版）,2010(01):90-96.
[6]	王海龙,王秀喜,梁海弋.金属Cu体熔化与表面熔化行为的分子动力学模拟与分析[J].金属学报,2005(06):568-572.
[7]	Yu C;Liu JY;Lu H;Chen JM .Study of the effects of an adatom Sn on the Cu surface electromigration using a first principles method[J].Applied Surface Science: A Journal Devoted to the Properties of Interfaces in Relation to the Synthesis and Behaviour of Materials,2007(21):8652-8656.
[8]	张弢,吴爱玲,管立,齐元华,徐昌业.液铜快速冷却过程微观结构演变的计算机模拟[J].化学学报,2003(09):1357-1361.
[9]	翟秋亚,杨扬,徐锦锋,郭学锋.快速凝固Cu-Sn合金的组织形态及相结构[J].中国有色金属学报,2006(08):1374-1379.
[10]	XU Jinfeng,WANG Nan,WEI Bingbo.Microstructural characteristics and electrical resistivity of rapidly solidified Co-Sn alloys[J].科学通报（英文版）,2004(21):2242-2247.
[11]	N.Ltimmen;T.Kraska .Homogeneous nucleation of iron from supersaturated vapor investigated by molecular dynamics simulation[J].Journal of Aerosol Science,2005(12):1409-1426.
[12]	杨扬,徐锦锋,翟秋亚.急冷条件下Cu-Sn合金的快速枝晶生长[J].中国有色金属学报,2007(09):1521-1526.
[13]	X. W. ZHOU;H. N. G. WADLEY;R. A. JOHNSON .ATOMIC SCALE STRUCTURE OF SPUTTERED METAL MULTILAYERS[J].Acta materialia,2001(19):4005-4015.

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