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新型的无铅钎料不仅要具备含铅钎料的工艺性能,更重要的是要有更高的力学性能,特别是焊接接头的抗蠕变能力.将纳米级多面齐聚倍半硅氧烷(Polyhedral oligomeric silsesquioxanes,POSS)颗粒作为增强相添加到基体钎料中,能够有效地改善Sn-3.5Ag基复合钎料的性能.研究了不同种类POSS增强颗粒对Sn-3.5Ag钎料显微组织和力学性能的影响,确定出POSS增强颗粒复合钎料的最佳配比,并对最佳配比复合钎料在不同温度不同载荷条件下的蠕变寿命进行了研究.结果表明:POSS颗粒质量分数小于2%时,可以抑制基板界面处初晶金属间化合物的生长;复合钎料的抗剪切强度明显提高;低温时,最大蠕变寿命明显改善.

参考文献

[1] Zhao J,Miyashita Y,Mutoh Y.Fatigue crack growth behavior of 96.5Sn-3.5Ag lead-free solder[J].International Journal of Fatigue,2001,23(8):723-731.
[2] Marshall J L,Calderon J.Hard-particle reinforced composite solders[J].Soldering and Surface Mount Technology,1997,9(2):39-58.
[3] Marshall J L,Calderon J,Sees,J,et al.Composite solder[J].IEEE Transactions on Components,Hybrids,and Manufacturing Technology,1991,14(4):698-702.
[4] Li G,Wang L,Ni H,et al.Polyhedral oligomeric silsesquioxane (POSS) polymers and copolymers:A review[J].J Inorg Organomet Polym,2001,11(3):123-154.
[5] Lee A,Subramanian K N.Development of nano-composite lead-free electronic solders[J].Journal of Electronic Materials,2005,34(11):1399-1407.
[6] Phillips S H,Haddad T S,Tomczak S J.Developments in nanoscience:Polyhedral oligomeric silsesquioxane (POSS)-polymers[J].Solid Statc and Material Science,2004,8(1):21-29.
[7] 邰枫,郭福,刘彬,等.温时效对新型Sn-Ag基复合钎料显微组织和力学性能的影响[J].复合材料学报,2008,25(5):8-13.Tai Feng,Guo Fu,Liu Bin,et al.Microstructure evolution and mechanical properties of Sn-Ag based composite solder joints during isothermal aging[J].Acta Materiae Compositae Sinica,2008,25(5):8-13.
[8] 徐国财,张立德.纳米复合材料[M].北京;化学工业出版社,2002:136-141.
[9] Guo F,Lee A,Subramanian K N.Creep behavior of composite lead-free electronic solder joints[J].Soldering and Surface Mount Technology,2003,15(1):39-42.
[10] Bowers M T,Anderson S,Baker E S,et al.3-dimenaional structure characterization of cationized polyhedral oligomeric silsesquioxanas (POSS) with styryl and phenethyl capping agents[J].lnt J Mass Spectrom,2003,227(1):205-216.
[11] Geng Haiping.Structure/property relationships of polymers containing hybrid nano-filler--polyhedral oligomeric silsesquioxanes (POSS)[D].USA:Michigen State University,2002.
[12] 刘彬,刘建萍,高小雨,等.热疲劳对纳米结构强化的无铅焊点性能的影响[J].稀有金属,2009,33(2);205-210.Liu Bin,Liu Jianping,Gao Xiaoyu,et al.Properties of leadfree solder joint containing nano-structured reinforcements during on thermomechanical fatigue[J].Chinese Journal of Rare Metals,2009,33(2):205-210.
[13] Rhee H,Subramanian K N,Lee A.Role of imposed cyclic straining on the stress relaxation behavior of eutectic Sn -3.5Ag solder joints[J].Materials in Electronics,2005,16(3):169-176.
[14] Lee A,Feher F J,Brem G F,etal.Breakthrough polymer finishing technology:Manufacturing productivity and polymer performance enhancements[C]// Annual Technical Conference-ANTEC.USA:Society of Plastics Engineers,2003,3:2798-2803.
[15] 于大全,段莉蕾,赵杰,等.Sn-3.5Ag/Cu界面金属间化合物的生长行为研究[J].材料科学与工艺,2005,13(5):532-535.Yu Daquan,Duan I.ilei,Zhao Jie,et al.The growth behaviors of intermetaUic compounds between Sn-3.5Ag and Cu substrate[J].Material Science and Technology,2005,13(5):532-535.
[16] 闫焉服,刘建萍,史耀武,等.铜颗粒增强对锡铅钎料蠕变寿命的影响[J].电子工艺技术,2004,25(1):20-22.Yan Yanfu,Liu Jianping,Shi Yaowu,et al.Effect of enhanced particles Cu on creep rupture life of SnPb based composite solder[J].Electronics Process Technology,2004,25(1):20-22.
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