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报道了一种新型疏水型介孔氧化硅薄膜的制备方法.用红外光谱、小角XRD、原子力显微镜对样品进行了表征,并采用椭偏仪和阻抗分析仪测量薄膜的折射率和介电常数.该薄膜具有很低的介电常数和较好的机械强度,是一种可用于微电子工业、极富应用前景的低介电常数材料.

参考文献

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