采用高能球磨方法制备了超细Mo-Cu复合粉末,通过X射线衍射,金相显微镜,扫描电镜和透射电镜等方法研究分析了所制备Mo-Cu粉末的烧结致密化、显微组织及性能的变化,并与未球磨粉末的烧结试样进行了比较.结果表明:经机械合金化的Mo-Cu粉末处于非平衡储能状态,烧结活性较高,使致密化温度降低80～100℃;其成形压坯在1250℃下烧结1.5h后,性能较佳,相对密度达到97.9%,且烧结体Mo、Cu两相分布均匀,其硬度、电导率、热导率分别达到70.10HRB、23.17ms/m、179.33W/(m·K),与未球磨粉末烧结体性能相比,都有了显著提高;过高的烧结温度与过长烧结时间,会引起Mo晶粒的明显长大.
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