强磁场下铜电沉积层表面形貌及织构的研究

稀有金属材料与工程, 2006, 35(z1): 381-385.

强磁场下铜电沉积层表面形貌及织构的研究

黄琦晟 ^1, , 钟云波 ^2, , 任忠鸣 ^3, , 温艳玲 ^4, , 邓康 ^5,

1.上海大学,上海市现代冶金与材料制备重点实验室,上海,200072

2.上海大学,上海市现代冶金与材料制备重点实验室,上海,200072

3.上海大学,上海市现代冶金与材料制备重点实验室,上海,200072

4.上海大学,上海市现代冶金与材料制备重点实验室,上海,200072

5.上海大学,上海市现代冶金与材料制备重点实验室,上海,200072

基金项目: 上海市科委重点基础研究项目(03JC14029)

关键词：强磁场 , 铜电沉积 , 表面形貌 , 织构

Surface Crystal Morphology and Texture of Electro-Deposited Layer of Copper in Static High Magnetic Field

利用SEM和XRD研究了无磁场和2 T～10 T强磁场中电流密度和磁感应强度对铜电沉积层表面形貌及择优取向的影响.结果表明:无磁场下,表面晶粒随电流密度增加而增大,同时伴随氢气析出而导致气孔出现,施加10 T磁场后,表面晶粒随电流密度增加呈分裂细化趋势,同时氢气析出被抑制.强磁场施加使(220)晶面织构得到抑制,而(111),(200),(311)等晶面的织构得到增强,但无论是否施加磁场,在200A/m2～630A/m2的电流密度下,铜电沉积层仍保持(220)的优先生长方向.

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强磁场下铜电沉积层表面形貌及织构的研究

Surface Crystal Morphology and Texture of Electro-Deposited Layer of Copper in Static High Magnetic Field

参考文献