随着电子工业飞速发展以及人们环保意识的提高,以"绿色焊接"为主题的电子装配技术对无铅焊料的需求也尤为迫切.本文从焊料可焊性和焊接结构的可靠性等方面介绍了近年来国内外无铅焊料研究方面的最新成果;着重概括了为提高焊接性能而在配料组分、金属间化合物析出与组织控制等工作,重点阐明了稀土元素在焊料组织控制中的关键作用;针对我国稀土资源蕴藏丰富的特点,指出了无铅焊料进一步发展的方向.
参考文献
| [1] | Cannis J .[J].Advances in Packaging,2001,8:33-38. |
| [2] | Abtew M;Selvaduray G .[J].Materials Science and Engineering,2000,27:95-141. |
| [3] | Wu C M L;Yu D Q;Law C M T et al.[J].Materials Science and Engineering R:Reports,2004,44:1-44. |
| [4] | Zeng K.;Tu KN. .Six cases of reliability study of Pb-free solder joints in electronic packaging technology [Review][J].Materials Science & Engineering, R. Reports: A Review Journal,2002(2):55-105. |
| [5] | Saiz E;Hwang C W;Suganuma K et al.[J].Acta Materialia,2003,51:3185-3197. |
| [6] | ChangTC;Hsu Y T;Hon M H et al.[J].Journal of Alloys and Compounds,2003,360:217-224. |
| [7] | Wang L;Yu D Q;Zhao J et al.[J].Materials Letters,2002,56:1039-1042. |
| [8] | Fouassier O;Chazelas J;Silvain J F .[J].Composites Part A:Applied Science and Manufacturing,2002,33:1391-1395. |
| [9] | Suganuma K;Murata T;Noguchi H et al.[J].Journal of Materials Research,2000,15(04):884-891. |
| [10] | Lee H T;ChenMH;JaoHM et al.[J].Materials Science and Engineering,2003,A358:134-141. |
| [11] | Ferreira J;Fernandes B;Goncalves C .[J].Materials Science and Engineering,2000,A288:248-252. |
| [12] | Fergusun K J;Telang A;Lee J G et al.[J].Journal of MATERIALS SCIENCE:MATERIALS IN ELECTRONICS,2003,14:157-164. |
| [13] | Kim K S;Huh S H;Suganuma K .[J].Journal of Alloys and Compounds,2003,352:226-236. |
| [14] | Chang TC.;Wang MC.;Hon MH. .Effect of aging on the growth of intermetallic compounds at the interface of Sn-9Zn-xAg/Cu substrates[J].Journal of Crystal Growth,2003(1/2):236-243. |
| [15] | SongJM;LanGF;LuiTS et al.[J].Scripta Materialia,2003,48:1047-1051. |
| [16] | ChangTC;Hon M H;Wang M C .[J].Journal of Alloys and Compounds,2003,352:168-174. |
| [17] | Jang J W;Frear D R;Lee T Y et al.[J].Journal of Applied Physics,2000,88(11):6359-6363. |
| [18] | Zhang F;Li M;Chum C C et al.[J].Journal of Materials Research,2002,17:2757-2760. |
| [19] | Suganuma K .[J].Current Opinion in Solid State and Materials Science,2001,5:55-64. |
| [20] | Kikuchi S;Nishimura M;Suetugu K et al.[J].Materials Science and Engineering A,2001,319-321:475-479. |
| [21] | Wiese S.;Feustel F.;Meusel E. .Characterisation of constitutive behaviour of SnAg, SnAgCu and SnPb solder in flip chip joints[J].Sensors and Actuators, A. Physical,2002(1/2):188-193. |
| [22] | Guo F;Choi S;Subramanian K N .[J].Materials Science and Engineering,2003,A351:190-199. |
| [23] | Zhao J;Miyashita Y;Mutoh Y .[J].International Journal of Fatigue,2001,23:723-731. |
| [24] | Kanchanomai C;Miyashita Y;Mutoh Y et al.[J].Materials Science and Engineering,2003,A345:90-98. |
| [25] | Zhao J;Mutch Y;Miyashita Y et al.[J].Engineering Fracture Mechanics,2003,70:2187-2197. |
| [26] | Lin KL.;Liu TP. .The electrochemical corrosion behaviour of Pb-free Al-Zn-Sn solders in NaCl solution[J].Materials Chemistry and Physics,1998(2):171-176. |
| [27] | Mori M;Miura K;Sasaki T et al.[J].Corrosion Science,2002,44:887-898. |
| [28] | Kim K S;Huh S H;Suganuma K .[J].Microelectronics Reliability,2003,43:259-267. |
| [29] | Choi W K;Kim K H;Jeong S W et al.[J].Journal of Materials Research,2002,17:43-51. |
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