介孔材料是一类孔径分布在1.5~50nm之间的多孔材料,具有比表面积大,孔隙率高,孔径分布窄,孔排布有序的特点,在催化、分离等领域具有广阔的应用前景.综述了介孔材料近些年在制备、应用、机理等方面的最新进展与前景展望.
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