采用乙二胺作辅助配位剂在芳纶纤维上化学镀银,制备镀银导电Kevlar(凯夫拉)芳纶纤维.分别采用分析天平、扫描电镜(SEM)、X射线衍射(XRD)和万用表,研究了乙二胺对化学镀银层的增重率、表面形貌、晶体结构和表面电阻的影响,并探讨了化学镀银层的生长过程.结果表明,加入乙二胺后,镀液稳定性增强,纤维增重率提高到50%左右,表面电阻降低至03~0.4 Ω/cm,同时颗粒尺寸变大,抗老化性能增强.银镀层呈三维形核生长,颗粒尺寸随镀覆时间延长而增大,镀层外观也经历了由黑色到银灰色再到白色的转变过程.
参考文献
[1] | 孙晋良.纤维新材料[M].上海:上海大学出版社,2007:74-90. |
[2] | Lin JS. .Effect of surface modification by bromination and metalation on Kevlar fibre-epoxy adhesion[J].European Polymer Journal,2002(1):79-86. |
[3] | Zhang HP;Zhang JC;Chen JY;Hao XM;Wang SY;Feng XX;Guo YH .Effects of solar UV irradiation on the tensile properties and structure of PPTA fiber[J].Polymer Degradation and Stability,2006(11):2761-2767. |
[4] | Joon Jang;Seung Kon Ryu .Physical property and electrical conductivity of electroless Ag-plated carbon fiber-reinforced paper[J].Journal of Materials Processing Technology,2006(1/3):66-73. |
[5] | Anne Schwarz;Jean Hakuzimana;Anna Kaczynska;Jedrzej Banaszczyk;Philippe Westbroek;Eric McAdams;Gillian Moody;Yiannis Chronis;Georgios Priniotakis;Gilbert De Mey;Dimitris Tseles;Lieva Van Langenhove .Gold coated para-aramid yarns through electroless deposition[J].Surface & Coatings Technology,2010(9/10):1412-1418. |
[6] | Jiang SQ;Kan CW;Yuen CWM;Wong WK .Electroless nickel plating of polyester fiber[J].Journal of Applied Polymer Science,2008(4):2630-2637. |
[7] | Dan Tao;Qufu Wei;Yibing Cai .Functionalization of polyamide 6 nanofibers by electroless deposition of copper[J].JCT research,2008(3):399-403. |
[8] | 魏喆良.乙二胺对铜基材浸镀银的影响[J].表面技术,2008(02):31-33. |
[9] | 魏喆良,唐电.印刷电路板的乙二胺络合浸镀银工艺[J].福州大学学报(自然科学版),2007(04):616-619. |
[10] | 李晗晔 .铜基电镀银层防变色的研究[D].东北大学,2005. |
[11] | 吴自勤;王兵.薄膜生长[M].北京:科学出版社,2001:181-187. |
[12] | 杨保中 .化学镀纳米铜膜的工艺参数和表面形貌及沉积原理研究[D].长春:吉林大学,2007. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分:
-
10%
-
20%
-
30%
-
40%
-
50%