采用电子陶瓷工艺制备了一系列玻璃/锶长石陶瓷复合材料,并对复合材料进行X射线衍射分析、扫描电镜观察和性能测试.结果表明:复合材料的介电常数、热膨胀系数和显微硬度随着锶长石含量的增加而增加,而介电损耗随锶长石含量的增加而减小.锶长石含量大于50%(质量分数)的复合材料中α石英和方石英的析出增加了材料的热膨胀系数,但对材料的介电性能影响不大.所制备的复合材料具有低的介电常数(5.2～5.8)、低的介电损耗(0.10%～0.25%)、低的热膨胀系数(4.4 ×10-6～6.2×10-6℃-1)和低的烧结温度(≤900℃),有望用于电子封装领域.
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