以乙二胺四乙酸或柠檬酸作配位剂,在无氰的硫代硫酸盐-亚硫酸盐体系中研究了金在镀镍铜基底上的电沉积.在温度为60 ℃,pH为6和电流密度为2 A/dm2的条件下,研究了不同配位剂对电流效率、镀速、镀层硬度及镀液分散能力的影响.最佳的镀液组成为0.5 mol/L硫代硫酸钠-亚硫酸钠+0.2 mol/L乙二胺四乙酸(或0.3 mol/L柠檬酸).该镀液具有良好的分散能力及高达98%的电流效率.采用扫描电镜、原子力显微镜及X射线衍射分析了镀态金镀层的表面形貌和晶体结构.所得的金镀层几乎无孔(孔隙率＜2～4个/cm2),结合力良好,硬度适中(80～130 HV).
Electroplating of gold on Ni-plated Cu substrates from non-cyanide bath containing thiosulfate-sulfite with EDTA or citric acid as complexing agent was studied in terms of current efficiency, deposition rate, hardness and throwing power of the baths at 60 ℃, pH 6 and current density 2 A/dm2.An optimal bath composition was obtained, comprising 0.5 mol/L sodium thiosulfate-sodium sulfite and 0.2 mol/LEDTA (or 0.3 mol/L citric acid). The optimized bath has excellent throwing power and high current efficiency (98%).The surface morphology of the as-deposited gold was examined by scanning electron microscopy (SEM) and atomic force microscopy (AFM) while the crystal structure was examined by X-ray diffraction analysis. Nearly pore-free (less than 2 ～ 4 pores/cm2), well adherent deposits with moderate hardness values (80 ～ 130 HV) were obtained.
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