稀土元素以其独特的优势被称为金属材料的维他命,稀土元素的添加可以在不同程度上提高无铅钎料的性能.结合国内外在含稀土元素无铅钎料研究领域的最新研究成果,综合评论稀土元素对无铅钎料组织和性能的影响,阐述含稀土元素的无铅焊点可靠性研究现状,为该钎料的实际应用提供数据支撑,分析过量稀土元素对无铅钎料表面锡须的影响,探讨锡须的生长机制及潜在的问题,最后综合评述含稀土无铅钎料在研究过程中存在的问题以及相应的解决措施,为含稀土元素无铅钎料的研究和应用提供理论依据.
参考文献
[1] | 尹立孟,张新平.电迁移致无铅钎料微互连焊点的脆性蠕变断裂行为[J].电子学报,2009(02):253-257. |
[2] | Zeng K.;Tu KN. .Six cases of reliability study of Pb-free solder joints in electronic packaging technology [Review][J].Materials Science & Engineering, R. Reports: A Review Journal,2002(2):55-105. |
[3] | Changdong Zou;Yulai Gao;Bin Yang .Melting and solidification properties of the nanoparticles of Sn3.0Ag0.5Cu lead-free solder alloy[J].Materials Characterization,2010(4):474-480. |
[4] | Effect of alloying elements on properties and microstructures of SnAgCu solders[J].Microelectronic engineering,2010(11):2025-2034. |
[5] | 王丽凤,孙凤莲,吕烨,申旭伟.Sn-3.0Ag-0.5Cu-xNi无铅焊料及焊点的性能[J].焊接学报,2009(01):9-12. |
[6] | W.M. Chen;S.C. Yang;M.H. Tsai .Uncovering the driving force for massive spalling in the Sn-Cu/Ni system[J].Scripta materialia,2010(1):47-49. |
[7] | Xianfen Li;Fei Zhang;Fangqiu Zu;Xue Lv;Zhenxing Zhao;Dongdong Yang .Effect of liquid–liquid structure transition on solidification and wettability of Sn–0.7Cu solder[J].Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics,2010(2):472-475. |
[8] | Jun SHEN;Yongchang LIU;Dongjiang WANG .Nano ZrO_2 Particulate-reinforced Lead-Free Solder Composite[J].Journal of Materials Science & Technology,2006(4):529-532. |
[9] | 李仕明,余春,陆皓.锗元素对Sn-3.5Ag合金/铜界面反应的影响[J].机械工程材料,2009(09):21-24. |
[10] | Liang Zhang;Song-bai Xue;Li-li Gao;Zhong Sheng;Huan Ye;Zheng-xiang Xiao;Guang Zeng;Yan Chen;Sheng-lin Yu .Development of Sn-Zn lead-free solders bearing alloying elements[J].Journal of Materials Science. Materials in Electronics,2010(1):1-15. |
[11] | 周健,王常亮,薛烽.Sn-Zn钎料Cu接头的界面反应及力学性能[J].东南大学学报(自然科学版),2009(03):615-622. |
[12] | BO LI;YAOWU SHI;YONGPING LEI;FU GUO;ZHIDONG XIA;BIN ZONG .Effect of Rare Earth Element Addition on the Microstructure of Sn-Ag-Cu Solder Joint[J].Journal of Electronic Materials,2005(3):217-224. |
[13] | 王俭辛 .稀土Ce对Sn-Ag-Cu和Sn-Cu-Ni钎料性能及焊点可靠性影响的研究[D].南京航空航天大学,2009. |
[14] | 王慧 .微合金化对Sn-9Zn无铅钎料性能影响及相关机理研究[D].南京:南京航空航天大学,2010. |
[15] | 朱颖.Sn-Pb-Ce-La钎料合金的显微组织分析[J].稀土,1994(01):57. |
[16] | 邱小明;李世权;万传庚;赵旭日 .稀土对锡铅钎料润湿性和接头强度的影响[J].吉林工业大学自然科学学报,1994,24(76):73-77. |
[17] | Liang Zhang;Song-bai Xue;Li-li Gao;Guang Zeng;Zhong Sheng;Yan Chen;Sheng-lin Yu .Effects of rare earths on properties and microstructures of lead-free solder alloys[J].Journal of Materials Science. Materials in Electronics,2009(8):685-694. |
[18] | C.M.L. Wu;D.Q. Yu;C.M.T. Law;L. Wang .Properties of lead-free solder alloys with rare earth element additions[J].Materials Science & Engineering, R. Reports: A Review Journal,2004(1):1-44. |
[19] | CHUANG T H;YEN S F .Abnormal growth of tin whiskers in a Sn3Ag0.5Cu0.5Ce solder ball array package[J].Journal of Electrronic Materials,2006,35(08):1621-1627. |
[20] | 韩宗杰 .电子组装元器件半导体激光无铅软钎焊技术研究[D].南京航空航天大学,2009. |
[21] | Z.G. Chen;Y.W. Shi;Z.D. Xia;Y.F. Yan .Study on the Microstructre of a Novel Lead-Free Solder Alloy SnAgCu-RE and Its Soldered Joints[J].Journal of Electronic Materials,2002(10):1122-1128. |
[22] | CHEN Z G;SHI Y W;XIA Z D;YAN Y F .Properties of lead-free solder SnAgCu containing minute amounts of rare earth[J].Journal of Electronic Materials,2008,32(04):235-243. |
[23] | 李擘,史耀武,夏志东,雷永平,郭福.添加微量稀土元素的SnAgCu无铅钎料的研究[J].电子工艺技术,2004(05):193-198. |
[24] | 易江龙,张宇鹏,许磊,刘凤美,杨凯珍.混合稀土对Sn-0.70Cu-0.05Ni钎料组织与性能的影响[J].电子元件与材料,2011(02):25-28. |
[25] | Zhidong Xia;Zhigang Chen;Yaowu Shi;Nan Mu;Na Sun .Effect of Rare Earth Element Additions on the Microstructure and Mechanical Properties of Tin-Silver-Bismuth Solder[J].Journal of Electronic Materials,2002(6):564-567. |
[26] | 薛松柏,刘琳,代永峰,姚立华.微量稀土元素铈对Sn-Ag-Cu无铅钎料物理性能和焊点抗拉强度的影响[J].焊接学报,2005(10):23-26. |
[27] | 赖忠民 .Ga/In与稀土Ce对Ag30CuZnSn钎科显微组织及钎焊接头性能影响的研究[D].南京:南京航空航天大学,2011. |
[28] | M.A.DUDEK;R.S.SIDHU;N.CHAWLA .Microstructure and Mechanical Behavior of Novel Rare Earth-Containing Pb-Free Solders[J].Journal of Electronic Materials,2006(12):2088-2097. |
[29] | ZHANG L;XUE S B;GAO L L;CHEN Y YU S L SHENG Z ZENG G .Microstrocture and creep properties of Sn-Ag-Cu lead-free solders bearing minor amounts of the rare earth cerium[J].Soldering & Surface Mount Technology,2010,22(02):30-34. |
[30] | 张亮,薛松柏,曾广,皋利利,陈燕,盛重,禹胜林.铈对SnAgCu钎料的显微组织和性能影响[J].中国稀土学报,2009(02):246-250. |
[31] | H. HAO;J. TIAN;Y.W. SHI;Y.P. LEI;Z.D. XIA .Properties of Sn3.8Ag0.7Cu Solder Alloy with Trace Rare Earth Element Y Additions[J].Journal of Electronic Materials,2007(7):766-774. |
[32] | Yaowu Shi;Jim Tian;Hu Hao .Effects of small amount addition of rare earth Er on microstructure and property of SnAgCu solder[J].Journal of Alloys and Compounds,2008(1/2):180-184. |
[33] | Lili Gao;Songbai Xue;Liang Zhang;Zhengxiang Xiao;Wei Dai;Feng Ji;Huan Ye;Guang Zeng .Effect of praseodymium on the microstructure and properties of Sn3.8Ag0.7Cu solder[J].Journal of Materials Science. Materials in Electronics,2010(9):910-916. |
[34] | GAO L L;XUE S B;ZHANG L;SHENG Z ZENG G JI F .Effects of trace earth Nd addition on microstructure and properties of SnAgCu solder[J].Jousnal of Materials Science:Materials in Electronics,2010,21(07):643-648. |
[35] | Ainissa G. Ramirez;Hareesh Mavoori;Sungho Jin .Bonding nature of rare-earth-containing lead-free solders[J].Applied physics letters,2002(3):398-400. |
[36] | Hareesh Mavoori;Ainissa G. Ramirez;Sungho Jin .Universal solders for direct and powerful bonding on semiconductors, diamond, and optical materials[J].Applied physics letters,2001(19):2976-2978. |
[37] | MIN PEI;JIANMIN QU .Effect of Lanthanum Doping on the Microstructure of Tin-Silver Solder Alloys[J].Journal of Electronic Materials,2008(3):331-338. |
[38] | NOH B I;CHOI J H;YOON J W;JUNG S B .Effects of cerium content on wettability,minrostructure and mcehanical properties of Sn-Ag-Ce solder alloys[J].Journal of Alloys and Compounds,2010,499(02):154-159. |
[39] | WenXue Chen;Songbai Xue;Hui Wang;YuHua Hu;Jianxin Wang .Effects of rare earth Ce on properties of Sn-9Zn lead-free solder[J].Journal of Materials Science. Materials in Electronics,2010(7):719-725. |
[40] | 胡玉华,薛松柏,陈文学,王慧.Sn-9Zn-xCe钎料显微组织及钎焊性能的分析[J].焊接学报,2010(06):77-80. |
[41] | 卢斌,王娟辉,栗慧,牛华伟,焦羡贺.微量铈对Sn-0.7Cu-0.5Ni焊料合金组织与性能的影响[J].中国稀土学报,2007(02):217-223. |
[42] | Guang Zeng;Songbai Xue;Liang Zhang;Lili Gao;Wei Dai;Jiadong Luo .A review on the interfacial intermetallic compounds between Sn-Ag-Cu based solders and substrates[J].Journal of Materials Science. Materials in Electronics,2010(5):421-440. |
[43] | J.-W. Yoon;Y.-H. Lee;D.-G. Kim .Intermetallic compound layer growth at the interface between Sn-Cu-Ni solder and Cu substrate[J].Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics,2004(1/2):151-157. |
[44] | 卢斌,王娟辉,栗慧,朱华伟,焦宪贺.添加0.10%Ce对Sn-0.7Cu-0.5Ni焊料与Cu基板间界面IMC的影响[J].中国有色金属学报,2007(03):390-395. |
[45] | C.M.T.LAW;C.M.L.WU;D.Q.YU;L.WANG;J.K.L.LAI .Microstructure,Solderability,and Growth of Intermetallic Compounds of Sn-Ag-Cu-RE Lead-Free Solder Alloys[J].Journal of Electronic Materials,2006(1):89-93. |
[46] | 王要利,张柯柯,刘帅,赵国际.微连接用Sn-2.5Ag-0.7Cu(0.1RE)钎料焊点界面Cu_6Sn_5的长大行为[J].稀有金属材料与工程,2010(01):117-121. |
[47] | HU HAO;YAOWU SHI;ZHIDONG XIA;YONGPING LEI;FU GUO .Microstructure Evolution of SnAgCuEr Lead-free Solders Under High Temperature Aging[J].Journal of Electronic Materials,2008(1):2-8. |
[48] | 周迎春,潘清林,李文斌,梁文杰,何运斌,李运春,路聪阁.La对Sn-Ag-Cu无铅钎料与铜钎焊接头金属间化合物的影响[J].中国有色金属学报,2008(09):1651-1657. |
[49] | M.A. Dudek;R.S. Sidhu;N. Chawla .Novel Rare-Earth-Containing Lead-Free solders with enhanced Ductility[J].JOM,2006(6):57-62. |
[50] | Guang Zeng;Songbai Xue;Liang Zhang;Zhong Sheng;Lili Gao .Reliability evaluation of SnAgCu/SnAgCuCe solder joints based on finite element simulation and experiments[J].Soldering & Surface Mount Technology,2010(4):57-64. |
[51] | 张亮 .SnAgCu系无铅焊点可靠性及相关理论研究[D].南京航空航天大学,2011. |
[52] | LAW C M L;WU C M L;YU D Q;L1 M CHI D Z .lnteffacial microstructure and strength of lead-free Sn-Zn-RE BGA solder bumps[J].IEEE Transactions on Advanced Packaging,2005,28(02):252-257. |
[53] | Zhengxiang Xiao;Songbai Xue;Yuhua Hu;Huan Ye;Lili Gao;Hui Wang .Properties and microstructure of Sn-9Zn lead-free solder alloy bearing Pr[J].Journal of Materials Science. Materials in Electronics,2011(6):659-665. |
[54] | Yu-hua Hu;Song-bai Xue;Hui Wang;Huan Ye;Zheng-xiang Xiao;Li-li Gao .Effects of rare earth element Nd on the solderability and microstructure of Sn-Zn lead-free solder[J].Journal of Materials Science. Materials in Electronics,2011(5):481-487. |
[55] | HWA-TENG LEE;YIN-FA CHEN .Influence of Lanthanum Additions on the Microstructure and Microhardness of Sn-3.5Ag Solder[J].Journal of Electronic Materials,2009(10):2148-2157. |
[56] | M.A. Dudek;N. Chawla .Three-dimensional (3D) microstructure visualization of LaSn_3 intermetallics in a novel Sn-rich rare-earth-containing solder[J].Materials Characterization,2008(9):1364-1368. |
[57] | Xin Ma;Yiyu Qian;F. Yoshida .Effect of La on the Cu-Sn intermetallic compound (IMC) growth and solder joint reliability[J].Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics,2002(1/2):224-227. |
[58] | Lee TY.;Choi WJ.;Tu KN.;Jang JW.;Kuo SM.;Lin JK.;Frear DR.;Zeng K. Kivilahti JK. .Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn-3.5Ag, Sn-3.8Ag-0.7Cu and Sn-0.7Cu) on Cu[J].Journal of Materials Research,2002(2):291-301. |
[59] | 陈燕 .稀土铈对锡银铜无铅钎料组织性能的影响[D].机械科学研究总院,2006. |
[60] | Xin Ma;Fusahito Yoshida .Interaction relation in 60Sn-Pb-0.05La ternary solder alloy[J].Materials Letters,2002(4):441-445. |
[61] | 于大全 .电子封装互连无铅钎料及其界面问题研究[D].大连理工大学,2004. |
[62] | 陈志刚 .SnAgCuRE钎焊接头蠕变行为的研究[D].北京工业大学,2003. |
[63] | 孙凤莲,胡文刚,王丽凤,马鑫.Bi对Sn-0.3Ag-0.7Cu无铅钎料熔点及润湿性能的影响[J].焊接学报,2008(10):5-8. |
[64] | 卢斌,栗慧,王娟辉,朱华伟,焦羡贺.稀土Er对Sn-3.0Ag-0.5Cu无铅焊料合金组织与性能的影响[J].中国有色金属学报,2007(04):518-524. |
[65] | 陈铮;周飞.材料连接原理[M].哈尔滨:哈尔滨工业大学出版社,2001:65-99. |
[66] | D.Q. Yu;J. Zhao;L. Wang .Improvement on the microstructure stability, mechanical and wetting properties of Sn-Ag-Cu lead-free solder with the addition of rare earth elements[J].Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics,2004(1/2):170-175. |
[67] | ZHAO Xiao-yan,ZHAO Mai-qun,CUI Xiao-qing,XU Tian-han,TONG Ming-xin.Effect of cerium on microstructure and mechanical properties of Sn-Ag-Cu system lead-free solder alloys[J].中国有色金属学会会刊(英文版),2007(04):805-810. |
[68] | XUE Song-bai,YU Sheng-lin,WANG Xu-yan,LIU lin,HU Yong-fang,YAO Li-hua.Effects of rare earth element Ce on solderabilities of micron-powdered Sn-Ag-Cu solder[J].中国有色金属学会会刊(英文版),2005(06):1285-1289. |
[69] | Jian-Xin Wang;Song-Bai Xue;Zong-Jie Han .Effects of rare earth Ce on microstructures, solderability of Sn-Ag-Cu and Sn-Cu-Ni solders as well as mechanical properties of soldered joints[J].Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics,2009(1/2):219-226. |
[70] | 董文兴,史耀武,雷永平,夏志东,郭福.Ni/P/Ce元素对SnAgCu无铅钎料性能和组织的影响[J].稀有金属材料与工程,2010(10):1759-1763. |
[71] | L. Wang;D.Q. Yu;J. Zhao .Improvement of wettability and tensile property in Sn-Ag-RE lead-free solder alloy[J].Materials Letters,2002(6):1039-1042. |
[72] | C. M. L. Wu;D. Q. Yu;C. M. T. Law .Improvements of microstructure, wettability, tensile and creep strength of eutectic Sn-Ag alloy by doping with rare-earth elements[J].Journal of Materials Research,2002(12):3146-3154. |
[73] | 袁宜耀 .稀土Ce对Sn基无铅焊料的组织、性能及界面影响[D].昆明:昆明理工大学,2008. |
[74] | LAW C M T .Reliability and interfacial reaction of lead-free solder alloys doped with rare earth elements[D].Hongkong:City University of Hongkong,2004. |
[75] | 王俭辛,薛松柏,黄翔,韩宗杰,禹胜林.氮气保护对Sn-Cu-Ni-Ce无铅钎料润湿性的影响[J].焊接学报,2007(01):49-52. |
[76] | 史益平 .微量稀土Ce对Sn-Cu-Ni钎料焊点可靠性影响的研究[D].南京航空航天大学,2008. |
[77] | 李建新 .新型Sn-Cu系无银无铅焊料的研究[D].江苏大学,2009. |
[78] | C.M.L.Wu;C.M.T.Law;D.Q.Yu;L.Wang .The Wettability and Microstructure of Sn-Zn-RE Alloys[J].Journal of Electronic Materials,2003(2):63-69. |
[79] | C.M.L.Wu;C.M.T.Law;D.Q.Yu;L.Wang .The Properties of Sn-9Zn Lead-Free Solder Alloys Doped with Trace Rare Earth Elements[J].Journal of Electronic Materials,2002(9):921-927. |
[80] | 张启运.无铅钎焊的困惑、出路和前景[J].焊接,2007(02):6-10. |
[81] | 薛松柏,张亮,皋利利,禹胜林,朱宏.微量元素对无铅钎料性能影响的研究现状与发展趋势[J].焊接,2009(03):24-33. |
[82] | 陈文学 .Ag、Ga、 Al及Ce对Sn-9Zn无铅钎料性能的影响[D].南京:南京航空航天大学,2010. |
[83] | 王炜 .无铅焊料Sn-Zn-xLa的制备和研究[D].上海:复旦大学,2008. |
[84] | ZHOU Jian,SUN Yang-shan,XUE Feng.Effect of Nd and La on surface tension and wettability of Sn-8Zn-3Bi solders[J].中国有色金属学会会刊(英文版),2005(05):1161-1165. |
[85] | Jian Zhou;Dan Huang;Yi-Li Fang .Investigation on properties of Sn-8Zn-3Bi lead-free solder by Nd addition[J].Journal of Alloys and Compounds,2009(2):903-907. |
[86] | 张建纲,黄继华,戴志锋,张华,赵兴科.含稀土Sn-Zn-Bi系无铅钎料润湿性能的研究[J].中国稀土学报,2006(05):586-591. |
[87] | ZHANG Liang,XUE Songbai,HAN Zongjie,WANG Jianxin,GAO Lili,SHENG Zhong.MECHANICAL PROPERTIES OF FINE PITCH DEVICES SOLDERED JOINTS BASED ON CREEP MODEL[J].机械工程学报(英文版),2008(06):82-85. |
[88] | 黄明亮 .电子封装无铅钎料的研究[D].大连:大连理工大学,2001. |
[89] | DALY A A W;HAMMAD A E .Effects of small addition of Ag and/or Cu on the microstructure and properties of Sn-gZn lead-free solders[J].Materials Science and Engineering A,2010,527(20):5212-5219. |
[90] | 陈志刚,史耀武,夏志东.微量混合稀土对SnAgCu钎料合金性能的影响[J].电子工艺技术,2003(02):53-58. |
[91] | Guangdong Li;Yaowu Shi;Hu Hao;Zhidong Xia;Yongping Lei;Fu Guo;Xiaoyan Li .Effect of rare earth addition on shear strength of SnAgCu lead-free solder joints[J].Journal of Materials Science. Materials in Electronics,2009(2):186-192. |
[92] | LAW C M T;WU C M L.Microstructure evolution and shear strength of Sn-3.5Ag-RE lead-free BGA solder balls[A].上海:IEEE,2004:60-65. |
[93] | Lee, H.-T.;Chen, Y.-F.;Schwedt, A.;Mayer, J. .Effect of La addition on adhesive strength and fracture behavior of Sn-3.5Ag solder joints[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2011(10/11):3630-3638. |
[94] | 杨长勇,徐九华,丁文锋,傅玉灿,陈珍珍.稀土La改性Ag-Cu-Ti钎料的显微组织和力学性能[J].焊接学报,2010(01):67-70,74. |
[95] | C. M. L. Wu;Y. W. Wong .Rare-earth additions to lead-free electronic solders[J].Journal of Materials Science. Materials in Electronics,2007(1/3):77-91. |
[96] | C.M.L.Wu;C.M.T.Law;D.Q.Yu;L.Wang .Microstructure and Mechanical Properties of New Lead-Free Su-Cu-RE Solder Alloys[J].Journal of Electronic Materials,2002(9):928-932. |
[97] | F. Tai;F. Guo;M.T. Han;Z.D. Xia;Y.P. Lei;Y.W. Shi .Creep and thermomechanical fatigue properties of in situ Cu6Sn5 reinforced lead-free composite solder[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2010(15):3335-3342. |
[98] | Zhigang Chen;Yaowu Shi;zhidong Xia .Constitutive Relations on Creep for SnAgCuRE Lead-Free Solder Joints[J].Journal of Electronic Materials,2004(9):964-971. |
[99] | M.A. DUDEK;N. CHAWLA .Effect of Rare-Earth (La, Ce, and Y) Additions on the Microstructure and Mechanical Behavior of Sn-3.9Ag-0.7Cu Solder Alloy[J].Metallurgical and Materials Transactions, A. Physical Metallurgy and Materials Science,2010(3):610-620. |
[100] | 冯武锋,王春青,李明雨.电子元件焊接中的钎料合金研制及设计方法[J].电子工艺技术,2000(02):47-52. |
[101] | ZHANG Liang,XUE Song-bai,GAO Li-li,ZENG Guang,CHEN Yan,YU Sheng-lin,SHENG Zhong.Creep behavior of SnAgCu solders with rare earth Ce doping[J].中国有色金属学报(英文版),2010(03):412-417. |
[102] | Rodney J. McCabe;Morris E. Fine .The creep properties of precipitation strengthened tin-based alloys[J].JOM,2000(6):33-35. |
[103] | V.I. IGOSHEV;J.I. KLEIMAN;D. SHANGGUAN .Microstructure Changes in Sn-3.5Ag Solder Alloy during Creep[J].Journal of Electronic Materials,1998(12):1367-1371. |
[104] | OLIVER W C;NIX W D .High temperature deformation of oxide dispersion strengthened Al and Al-Mg solid solutions[J].Acta Metallurgica,1982,30(07):1335-1347. |
[105] | PEI M .Effects of lanthanum doping on the microstructure and mechanical behavior of a SnAg alloy[D].Georgia:Georgia Institute of Technology,2007. |
[106] | WeiMin Xiao;YaoWu Shi;GuangChen Xu .Effect of rare earth on mechanical creep-fatigue property of SnAgCu solder joint[J].Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics,2009(1/2):198-202. |
[107] | He, HW;Xu, GC;Guo, F .Effect of small amount of rare earth addition on electromigration in eutectic SnBi solder reaction couple[J].Journal of Materials Science,2009(8):2089-2096. |
[108] | R. Mahmudi;A. R. Geranmayeh;B. Zahiri;M. H. Marvasti .Effect of rare earth element additions on the impression creep of Sn-9Zn solder alloy[J].Journal of Materials Science. Materials in Electronics,2010(1):58-64. |
[109] | MAHMUDI R;GERANMAYEH A R;SALEHI M;PIRAYESH H .Impression creep of the rare-earth doped Sn-2%Bi lead-free solder alloy[J].Journal of Materials Science:Materials in Electronics,2010,21(03):262-269. |
[110] | 张亮,薛松柏,卢方焱,韩宗杰,禹胜林,赖忠民.基于蠕变模型细间距器件焊点疲劳寿命预测[J].机械工程学报,2009(09):279-284. |
[111] | KIM D H .Reliability study of SnPb and SnAg solder joints in PBGA packages[D].Austin:The University of Texas,2007. |
[112] | Jinglin Bi;Anmin Hu;Jing Hu;Tingbi Luo;Ming Li;Dali Mao .Effect of Cr additions on interfacial reaction between the Sn-Zn-Bi solder and Cu/electroplated Ni substrates[J].Microelectronics and reliability,2011(3):636-641. |
[113] | Nai-Shuo Liu;Kwang-Lung Lin .Evolution of interfacial morphology of Sn-8.5Zn-0.5Ag-0.1Al-xGa/Cu system during isothermal aging[J].Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics,2008(1/2):466-473. |
[114] | Min He;Zhong Chen;Guojun Qi .Solid state interfacial reaction of Sn-37Pb and Sn-3.5Ag solders with Ni-P under bump metallization[J].Acta materialia,2004(7):2047-2056. |
[115] | HU Y F;XUE S B;WU Y X .FEM analysis of stress and strain and evaluation on reliability of soldered CBGA joints under thermal cycling[J].Transactions of Nonferrous Metals Society of China,2005,15(z3):s317-s322. |
[116] | Liang Zhang;Song-bai Xue;Li-li Gao;Zhong Sheng;Sheng-lin Yu;Yan Chen;Wei Dai;Feng Ji;Zeng Guang .Reliability study of Sn-Ag-Cu-Ce soldered joints in quad flat packages[J].Microelectronics and reliability,2010(12):2071-2077. |
[117] | Liang Zhang;Song-bai Xue;Li-li Gao;Zhong Sheng;Guang Zeng;Yan Chen;Sheng-lin Yu .Properties of SnAgCu/SnAgCuCe soldered joints for electronic packaging[J].Journal of Materials Science. Materials in Electronics,2010(6):635-642. |
[118] | ZHANG L;XUE S B;GAO L L;SHENG Z DAI W JI F YE H CHEN Y YU S L .Effect of bulk Cu6Sn5 intermetallic compounds on properties of Sn-Ag-Cu-Ce solder joints[J].Soldering & Surface Mount Technology,2011,23(01):4-9. |
[119] | 郑智元 .锡银铜合金添加Ce无铅焊锡球格阵列封装之能态疲劳可靠度评估[D].台北:国立台湾大学,2009. |
[120] | 王俭辛,赖忠民,薛松柏.Sn-Cu-Ni(-Ce)焊点热循环可靠性[J].焊接学报,2010(02):36-40. |
[121] | Min Pei;Jianmin Qu .Creep and Fatigue Behavior of SnAg Solders With Lanthanum Doping[J].IEEE transactions on components and packaging technologies: A publication of the IEEE Components, Packaging, and Manufacturing Technology Society,2008(3):712-718. |
[122] | W. W. Lee;L. T. Nguyen;G. S. Selvaduray .Solder joint fatigue models: review and applicability to chip scale packages[J].Microelectronics and reliability,2000(2):231-244. |
[123] | ZAHN B A.Solder joint fatigue life model methodology for 63Sn37Pb and 95.5Sn4Ag0.5Cu matetials[A].New Orleans:IEEE,2003:93-94. |
[124] | SYED A.Accumulated creep strain and energy density based thermal fatigue life prediction models for SnAgCu solder joints[A].Las Vegas,NV:IEEE,2004:737-746. |
[125] | SCHUBERT A;DUDEK R;AUERSWALD E;GOLLHARDT A,MICHEL B,REICHL H.Fatigue life models for SnAgCu and SnPb solder joints evaluated by experiments and simulation[A].New Orleans:IEEE,2003:603-610. |
[126] | H. WANG;S. XUE;W. CHEN;X. LIU;J. PAN .Investigations of Sn-9Zn-Ag-Ga-Al-Ce Solder Wetted on Cu, Au/Ni/Cu, and Sn-plated Cu Substrates[J].Welding Journal,2010(12):249-s-255-s. |
[127] | 史晓亮,杨凯华,汤凤林,邵刚勤.稀土Ce的添加方式对WC-Co硬质合金性能的影响[J].中南大学学报(自然科学版),2005(02):204-208. |
[128] | S. H. Liu;Chih Chen;P. C. Liu;T. Chou .Tin whisker growth driven by electrical currents[J].Journal of Applied Physics,2004(12):7742-7747. |
[129] | H.P. Howard;J. Cheng;P.T. Vianco .Interface flow mechanism for tin whisker growth[J].Acta materialia,2011(5):1957-1963. |
[130] | CHUANG T H .Rapid whisker growth on the surface of Sn-3Ag-0.5Cu-1.0Ce solder joints[J].Scripta Materialia,2006,55(11):983-986. |
[131] | DUDEK M A;CHAWLA N .Mechanisms for Sn whisker growth rare earth-containing Pb-free solders[J].Acta Materialia,2009,57(1 5):4588-4599. |
[132] | M.A. Dudek;N. Chawla .Nanoindentation of rare earth-Sn intermetallics in Pb-free solders[J].Intermetallics,2010(5):1016-1020. |
[133] | 郝虎,李广东,史耀武,夏志东,雷永平,郭福,李晓延.稀土Ce加速Sn晶须生长的研究[J].稀有金属材料与工程,2009(05):866-869. |
[134] | 郝虎,史耀武,夏志东,雷永平,郭福,李晓延.Sn-3.8Ag-0.7Cu-1.0Er无铅钎料中Sn晶须变截面生长现象[J].金属学报,2009(02):199-203. |
[135] | 郝虎,李广东,史耀武,雷永平.SnAgCuCe/Er无铅钎料表面锡晶须的形态及特性[J].焊接学报,2009(05):25-28. |
[136] | T.H. CHUANG;H.J. LIN .Size Effect of Rare-Earth Intermetallics in Sn-9Zn-0.5Ce and Sn-3Ag-0.5Cu-0.5Ce Solders on the Growth of Tin Whiskers[J].Metallurgical and materials transactions. A, physical metallurgy and materials science,2008(12):2862-2866. |
[137] | Hsiu-Jen Lin;Tung-Han Chuang .Effects of Ce and Zn additions on the microstructure and mechanical properties of Sn-3Ag-0.5Cu solder joints[J].Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics,2010(2):167-174. |
[138] | HSIU-JEN LIN;TUNG-HAN CHUANG .Effects of Ce and La Additions on the Microstructure and Mechanical Properties of Sn-9Zn Solder Joints[J].Journal of Electronic Materials,2010(2):200-208. |
[139] | Huan Ye;Songbai Xue;Liang Zhang .Sn whisker growth in Sn-9Zn-0.5Ga-0.7Pr lead-free solder[J].Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics,2011(5):L52-L55. |
[140] | MENG LIU;AI-PING XIAN .Tin Whisker Growth on the Surface of Sn-0.7Cu Lead-Free Solder with a Rare Earth (Nd) Addition[J].Journal of Electronic Materials,2009(11):2353-2361. |
[141] | 王正明,张许静.稀土资源税对“寡头”国出口市场势力的影响研究[J].经济经纬,2012(02):52-55. |
[142] | K.S. Kim;C.H. Yu;J.M. Yang .Tin whisker formation of lead-free plated leadframes[J].Microelectronics and reliability,2006(7):1080-1086. |
[143] | Tung-Han Chuang;Chih-Chien Chi .Effect of adding Ge on rapid whisker growth of Sn-3Ag-0.5Cu-0.5Ce alloy[J].Journal of Alloys and Compounds,2009(2):974-980. |
[144] | Guo Q;Zhao M;Wang HF .SMT solder joint's semi-experimental fatigue model[J].Mechanics research communications,2005(3):351-358. |
[145] | 张亮,薛松柏,禹胜林,韩宗杰,皋利利,卢方焱,盛重.有限元模拟在微连接焊点可靠性研究中的应用[J].电焊机,2008(09):13-21,72. |
[146] | Siva P.V. Nadimpalli;Jan K. Spelt .Effect of geometry on the fracture behavior of lead-free solder joints[J].Engineering Fracture Mechanics,2011(6):1169-1181. |
[147] | ZHANG L;XUE S B;GAO L L;CHEN Y YU S L SHENG Z ZENG G .Effects of trace amount addition of rere earth on properties and microstructure of Sn-Ag-Cu alloys[J].Journal of Materials Science:Materials in Electronics,2009,20(12):1193-1199. |
[148] | 肖正香 .稀土Pr对Sn-9Zn无铅钎料组织与性能的影响[D].南京:南京航空航天大学,2011. |
[149] | Buban JP;Matsunaga K;Chen J;Shibata N;Ching WY;Yamamoto T;Ikuhara Y .Grain boundary strengthening in alumina by rare earth impurities[J].Science,2006(5758):212-215. |
[150] | 朱颖 .锡铅稀土钎料SMT焊点热循环失效机制研究[D].哈尔滨工业大学,1996. |
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