以超细球形Al粉为模板,通过化学镀在其表面包覆镀Au,制备出Al/Au核壳结构的复合粉末,利用放电等离子烧结(SPS)技术使镀Au层与基体铝粉表层实现合金化,并制备出具有Al/Al-Au合金核壳结构的前驱体块材,随后采用两步法腐蚀除去核壳结构中的Al核并在其表层实现选择性地除去Al-Au合金层中Al的去合金化反应,得到多孔金块材.利用XRD、SEM、EDS研究了镀覆工艺对Al粉模板表面镀Au效果的影响及烧结、腐蚀过程中物相及化学成分的变化规律.结果表明,活化处理和还原剂种类对Al粉表面的镀覆效果有重要影响,制备的块体多孔金由纳米级孔径(80~120nm)和微米级孔径(1~10μm)两级孔径结构构成,微观组织结构均匀,密度低达0.39g/cm3,孔隙率为98%.
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