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用搅拌摩擦加工法处理原位自生TiB2/7075复合材料,分析了经过不同加工道次的复合材料的微观结构、拉伸性能.结果表明:经过搅拌摩擦加工,搅拌区内的复合材料晶粒细小,颗粒大团聚被打散,颗粒在微米尺度分布更为均匀,同时消除了在制备过程中产生的浇铸缺陷.在搅拌区内复合材料的晶粒直径由45μm细化到2μm.与一道次加工相比,经过四道次搅拌摩擦加工的复合材料,其微观组织形貌更为均匀.缺陷的消除以及微观组织的改变,使复合材料搅拌区的拉伸性能得到显著提高,四道次加工的材料断裂强度为母材的1.3倍,而延伸率则为母材的8倍.

参考文献

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