采用料浆包渗法,以SiO2粉为Si源,纯Al粉为还原剂,NaF和NH4Cl作为复合活化剂,Al2O3为惰性添加剂,蛋白质(鸡蛋清)为粘结剂,在Cu表面预先镀Ni层随后900℃、12h表面渗Si,制备渗Si层.分别研究了CeO2和Al粉含量对渗Si层组织和摩擦性能的影响.结果表明:当铝粉含量20％时,CeO2含量由3％增加到6％,渗层组织为Ni2Si+ NiSi相；当CeO2含量6％时,铝粉含量由20％增加到30％,渗层组织变化过程:Ni2Si+ NiSi→NiAl→Ni2Al3相,包渗过程由渗硅向渗铝转变；两种渗层的最小摩擦系数都约为纯铜的1/5.
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