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TaN薄膜是一种重要的高新技术材料,主要介绍了物理气相沉积法(PVD)、金属有机化学气相沉积法(MOCVD)和原子层沉积法(ALD)制备TaN薄膜的工艺技术,评述了它们各自的优缺点.从前驱体的选择方面详细评述了MOCVD法和ALD法制备TaN薄膜的研究进展,比较和评述了各类前驱体的优缺点.总结了TaN薄膜的应用现状以及薄膜制备过程中的主要影响因素,并简要展望了其发展方向.

参考文献

[1] Tsai M H;Sun S C;Chiu H T et al.Metalorganic chemical vapor deposition of tantalum nitride by tertbutylimidotris (diethylamido)tantalum for advanced metallization[J].Journal of Applied Physics,1995,67(08):1128.
[2] Abe K;Harada Y;Onoda H .Study of crystal orientation in Cu film on TiN layered structures[J].J Vac Sci Teehn B,1999,17(04):1464.
[3] 陈秀华,王莉红,项金钟,吴兴惠,周桢来.超大规模集成电路铜布线扩散阻挡层TaN薄膜的制备研究[J].功能材料,2007(05):750-752.
[4] 蔡苇,符春林,邓小玲,程文德.CMOS器件用金属栅材料的研究进展[J].金属功能材料,2008(03):43-48.
[5] 刘成龙 .医用金属材料表面惰性涂层改性研究[D].大连理工大学,2005.
[6] 窦瑞芬 .网状阴极法在碳钢表面合成Ta和TaN薄膜的组织及其性能的研究[D].太原理工大学,1999.
[7] 杨文茂 .Ta-O及Ta-N薄膜的制备及其性能研究[D].西南交通大学,2006.
[8] Yosi Shacham-Diamand .Barrier Layers for Cu ULSI Metallization[J].Journal of Electronic Materials,2001(4):336-344.
[9] Hong Shen;Ravi Ramanathan .Fabrication of a low resistivity tantalum nitride thin film[J].Microelectronic engineering,2006(2):206-212.
[10] Hitchman M L.Chemical vapor deposition--Principles and applicatiom[M].London:Academic Press Limited,1993:56.
[11] Bunshah R F;McGuire G E.A sherman in chemical vapor deposition for microelectronics[M].Park Ridge:Noyes Publications,1987:108.
[12] Hoffmann D M .Chemical vapor deposition of nitride thin films[J].Polyhedron,1994,13(08):1169.
[13] Cho KN.;Noh KB.;Oh JE.;Paek SH.;Park CS.;Lee SI.;Lee MY. Lee JG.;Han CH. .Remote plasma-assisted metal organic chemical vapor deposition of tantalum nitride thin films with different radicals[J].Japanese journal of applied physics,1998(12A):6502-6505.
[14] Engbrecht ER.;Sun YM.;Smith S.;Pfiefer K.;Bennett J.;White JM. Ekerdt JG. .Chemical vapor deposition growth and properties of TaCxNy[J].Thin Solid Films: An International Journal on the Science and Technology of Thin and Thick Films,2002(2):145-150.
[15] Jun G C;Cho S L;Kim K B et al.Low temperature deposition of TaCN films using pentakis (diethylamido) tantalum[J].Japanese Journal of Applied Physics,1998,37(10):L30.
[16] Sung-Lae Cho;Ki-Bum Kim;Seok-Hong Min;Hyun-Kook Shin;Sam-Dong Kim .Diffusion barrier properties of metallorganic chemical vapor deposited tantalum nitride films against Cu metallization[J].Journal of the Electrochemical Society,1999(10):3724-3730.
[17] Lemberger M;Thiemann S;Baunemann A;Parala H;Fischer RA;Hinz J;Bauer AJ;Ryssel H .MOCVD of tantalum nitride thin films from TBTEMT single source precursor as metal electrodes in CMOS applications[J].Surface & Coatings Technology,2007(22/23):9154-9158.
[18] Masaru Kadoshima;Koji Akiyama;Katsuhiko Yamamoto;Hideaki Fujiwara;Tetsuji Yasuda;Toshihide Nabatame;Akira Toriumi .Improved C-V characteristics of metal-oxide-semiconductor capacitors with tantalum nitride gate electrodes grown by ultra-low-pressure chemical vapor deposition[J].Journal of Vacuum Science & Technology, B. Microelectronics and Nanometer Structures: Processing, Measurement and Phenomena,2005(1):42-47.
[19] Park S G;Lee Y K;Kang SB.Performance improvement of MOSFET with HfO2/Al2O3/laminate gate dielectric and CVD-TaN metal gate deposited by TAIMATA[A].San Francisco:IEEE Int,2003:13.
[20] Tin MKT.;Richeson DS.;Yap GPA. .Transition metal complexes of guanidinate dianions: Reactions between guanidines and M(NMe2)(5) (M = Ta, Nb)[J].Inorganic Chemistry: A Research Journal that Includes Bioinorganic, Catalytic, Organometallic, Solid-State, and Synthetic Chemistry and Reaction Dynamics,1998(26):6728-6730.
[21] Baunemann A .Precursor chemistry of tantalum and niobium nitride for MOCVD and ALD applications[D].Bochum:Ruhr-University,2007.
[22] M. Lemberger;A. Baunemann;A.J. Bauer .Chemical vapor deposition of tantalum nitride films for metal gate application using TBTDET and novel single-source MOCVD precursors[J].Microelectronics and reliability,2007(4/5):635-639.
[23] Kirkland W. Vogt;Paul A. Kohl;Joseph A. Abys .Nitridation and CVD Reactions with Hydrazine[J].AIChE Journal,1995(10):2282-2291.
[24] Bourret-Courchesne E.;Peters DW.;Arnold J.;Ahmed M.;Irvine SJC. Kanjolia R.;Smith LM.;Rushworth SA.;Ye Q. .Pyrolysis of dimethylhydrazine and its co-pyrolysis with triethylgallium[J].Journal of Crystal Growth,2000(1/2):47-54.
[25] Hiltunen L;Leskel(a) M;M(a)kel(a) M et al.Nitrides of titanium,niobium,tantalum and molybdenum grown as thin films by the atomic layer epitaxy method[J].Thin Solid Films,1988,166(01):149.
[26] Ritala M;Kalsi P;Riihel(a) D et al.Controlled growth of TaN,Ta3N5 and TaOxNy thin films by atomic layer deposition[J].CHEMISTRY OF MATERIALS,1999,11(07):1712.
[27] Petra Alen;Marika Juppo;Mikko Ritala .Atomic Layer Deposition of Ta(Al)N(C) Thin Films Using Trimethylaluminum as a Reducing Agent[J].Journal of the Electrochemical Society,2001(10):G566-G571.
[28] Petra Alen;Marika Juppo;Mikko Ritala .Tert-butylamine and allylamine as reductive nitrogen sources in atomic layer deposition of TaN thin films[J].Journal of Materials Research,2002(1):107-114.
[29] H. Kim;C. Lavoie;M. Copel;V. Narayanan;D.-G. Park;S. M. Rossnagel .The physical properties of cubic plasma-enhanced atomic layer deposition TaN films[J].Journal of Applied Physics,2004(10):5848-5855.
[30] Kim H.;Kellock AJ.;Rossnagel SM. .Growth of cubic-TaN thin films by plasma-enhanced atomic layer deposition[J].Journal of Applied Physics,2002(12):7080-7085.
[31] Park J S;Lee M J;Lee C S et al.Plasma-enhanced atomic layer deposition of tantalum nitrides using hydrogen radicals as a reducing agent electrochem[J].Solid-State Letters,2001,4(04):C17.
[32] Straten O V D;Zhu Y;Eisenbraun E et al.Thermal and electrical barrier performance testing of ultrathin atomic layer deposition tantalum-based materials for nanoscale copper metallization[J].Mat Res Soc Syrup Proc,2002,716:B11.
[33] Hong J W.Characteristics of PAALD-TaN thin films derived from TAIMATA precursor for copper metallization[A].New York:IEEE Press,2004:9.
[34] Na K I;Park S J;Jeong W C et al.Deposition and charac-teristics of tantalum nitride films by plasma assisted atomic layer deposition as Cu diffusion barrier[J].Materials Research Society Symposium Proceedings,2003,766:E3.22.1.
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