研究了化学镀三元Ni-Cu-P镀层的制备工艺,分析了三元Ni-Cu-P镀层成分、镀速的变化规律。通过DSA100接触角仪测试表明,所得三元Ni-Cu-P镀层均具有较大的接触角及较低的表面自由能。进一步的污垢沉积实验结果表明,与热交换器常用的不锈钢换热表面相比,4种三元Ni-Cu-P镀层表面均明显抑制了污垢的粘附。
In the present study,the authors studied the preparation process of ternary Ni-Cu-P deposits and discussed the composition and depositing rate of ternary Ni-Cu-P deposits as a function of copper sulphate concentration in the bath.The experimental results by DSA100 type contact angle tester showed that the ternary Ni-Cu-P deposits had higher contact angle and lower surface free energy.The further fouling experiments indicated that the surfaces of ternary Ni-Cu-P deposits with different phosphorus content inhibited the adhesion of fouling compared with the stainless steel surface of the heat exchangers.
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