高热流密度热控制或高性能服务器的冷却处理方式已受到广泛关注,其CPU散热量持续增高导致了能量分布的不均匀.本文对计算机服务器CPU的耗能量、冷却效果等进行了实验研究.提出通过采用导热板扩大CPU散热面积,以及采用高导热相变设备,如新型热管式散热器来解决高热流密度器件能耗的处理办法.研究结果证实,对高热流密度器件依靠增大外界气流的速度来改善散热器的冷却性能并不明显,采用高效热管散热器强化芯片传热可满足大型计算机服务器CPU的冷却要求.
High heat flux thermal control or high performance server cooling approach have attracted widespread attention.The sustained increasing CPU heat dissipation leads to an uneven distribution of energy.In this paper we focus on the experimental researches of energy consumption and cooling performance of a computer server.We suggest that using heat conduction plate to enlarge the CPU radiating surface and adopting new phase transition device such as a new type of heat-pipe radiator so as to solve the problem of cooling high heat flux component.The result shows that an increase in the outside air current to improve the cooling performance of radiator is not obvious.
参考文献
[1] | Yiswannath R;Nair R;Wakharker V et al.Emerging Di-rections for Packaging Technologies[J].Interl Technology Journal,2002,6:61-74. |
[2] | Wei J;Cha A;Copeland D.Measurement of Vapor Cham-ber Performance[A].,2003:191-194. |
[3] | Sauciuc I.Thermal Performance and Key Chal-lenges for Future CPU Cooling Technologies[A].San Francisco,CA,USA,2005 |
[4] | Yovanovich M M;Marotta E E.Thermal Spreading and Contact Resistances[M].John Wiley and Sons,Inc,2003:261-393. |
[5] | Teertstra P;Yovanovich M M;Culham J R.Analytical Forced Convection Modeling of Plate Fin Heat Sinks[A].,1999:34-41. |
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