<正> 一、前言 锡铅焊料是电子、通讯、航空等工业广泛使用的钎焊材料。目前使用的含锡61％、含铅39％的共晶合金焊料(HLSnPb39)在液态下暴露于空气中会产生大量氧化渣,不仅造成锡消耗增加,而且影响自动焊接的质量。据统计仅全国电子工业每年因此而造成的经济损失达七千余万元。
Under conditions of simulating dip-soldering and wave-soldering, the oxidizability and solderability of molten NG solder developed recently by the authors were investigated and compared with those of HLSnPb39 and H63A solders made in Japan. The drossing weight of NG solder was about onefourth of that of HLSnPb 39 or H63A solder, which showed that NG solder was better than the other two solders in anti-oxidation. Experiments also showed that the wettability of NG solder was 40％ larger than that of HLSnPb39 solder. Results examined by SEM and AES show that the additional element Ga is highly enriched on the surface of NG solder. A dense and very thin film exists on the surface.
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