本文根据窄禁带半导体Hg1-xMnxTe的物理、化学特性,采用不同浓度的Br2-MeOH作为抛光液对Hg1-xMnxTe进行化学抛光,发现用3%的Br2-MeOH腐蚀液时腐蚀速率平稳且容易控制,能有效去除表面划痕,得到光亮、整洁表面.AFM分析发现,化学抛光后表面粗糙度降低19.8%,整体均匀性提高.SEM分析发现,化学抛光后表面损伤层被全部去除.77 K时,化学抛光前后的范德堡霍尔测量发现,晶片化学抛光后,电阻率增加.
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