在与传统LED散热基板散热性能比较的基础上,分析了国内外功率型LED散热基板的研究现状,介绍了金属芯印刷电路板、陶瓷基板、金属绝缘基板和金属基复合基板的结构特点、导热性能及封装应用,指出了功率型LED基板材料的发展趋势及需要解决的问题.
On the base of comparison with traditional packaging materials, the present technical research on heat-release substrates of high power LEDs is analyzed. Some new style of substrates(including metal core printed cir-cuit board, ceramic substrates, insulated metal substrates and metal matrix composite substrate) are introduced in the structural characteristics,thermal conductivity and packaging applications. In addition, the research trend and prob-lerns to be solved at present of packaging materials are pointed out.
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