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简述了低压继电器用触头材料的工作状态、性能要求和AgSnO2材料的典型制备工艺.通过分析电弧侵蚀作用后的触头表面组织结构及其对电性能的影响,提出了降低接触电阻、增强界面结合强度和分散电弧的主要改善手段,并展望了AgSnO2材料的发展趋势.

参考文献

[1] 马战红,贾江议,孙乐民.银金属氧化物(AgMeO)触头材料制备技术研究进展[J].材料开发与应用,2004(04):39-43.
[2] 刘辉,戚颖,谭光讯,覃向忠,贺国良.新型银氧化锡触头材料在汽车电器中的应用[J].汽车电器,2001(01):16-19.
[3] 李英民,薛纪文,王俊勃,屈银虎.AgSnO2电触头材料的研究进展[J].电工材料,2003(02):20-27.
[4] Ben Jemaa N.Contacts conduction and switching in DC levels[A].,2002:1.
[5] Chi Leung;Eric Streicher.Materials transfer in dynamic welding of Ag and Ag/SnO2 contact material[A].,2002:21.
[6] Kharin S N;Nouri H;Davies T.Influence of Inductance on the Arc Evolution In AgMeO Electrical Contacts[A].,2002:108.
[7] Chi Leung;Eric Streicher;Dennis Fitzgerald.Microstructure effect on reignition and welding properties of copper-tungsten electric contact[A].,2003:132.
[8] Yong Hoon Jang;J. R. Barber .Effect of contact statistics on electrical contact resistance[J].Journal of Applied Physics,2003(11):7215-7221.
[9] Jiro Makimoto;Makoto Hasegawa;Koichiro Sawa.A study on evaluation with weibull distribution function of contact conditions operated in inert gas atmospheres[A].,2002:184.
[10] Nielsen T.;Zahrai S.;Kaddani A. .Modelling evaporating metal droplets in ablation controlled electric arcs[J].Journal of Physics, D. Applied Physics: A Europhysics Journal,2001(13):2022-2031.
[11] 周兆锋,甘卫平.AgSnO2触头材料的研究进展[J].稀有金属与硬质合金,2004(02):53-56.
[12] Osamu Sakaguchi;Koya Takahashi;Toshiya Yamamoto.Performance investigation of contact material in 42VDC automotive relay[A].,2002:56.
[13] 张燕,王俊勃,李英民,陈立成,杨敏鸽,丁秉钧.AgSnO2触头材料及其添加剂的研究与发展[J].材料导报,2005(05):34-37.
[14] 凌国平,王尚军,孟亮.化学镀法制备超细Ag-SnO2粉末的烧结[J].粉末冶金技术,2005(03):204-207.
[15] 张昆华 .反应合成法制备银二氧化锡工艺及组织性能研究[D].昆明理工大学,2004.
[16] 陈敬超,孙加林,杜焰,周晓龙,甘国友.反应合成银氧化锡电接触材料导电性能研究[J].稀有金属材料与工程,2003(12):1053-1056.
[17] 荣命哲.电接触理论[M].北京:机械工业出版社,2004
[18] Jeannot D.;Pinard J. .Physical and chemical properties of metal oxide additions to Ag-SnO/sub 2/ contact materials and predictions of electrical performance[J].IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part A,1994(1):17-23.
[19] Yuan-shou shen;Lavernce Gould;Stephen Swann .DTA and TGA studies of four Ag-MeO electrical contact materials[J].IEEE Transaction on Components and Manufacturing Technology,1985,8(03):352.
[20] Paul M. Weaver;Kesorn Pechrach;John W. McBride .The Energetics of Gas Flow and Contact Erosion During Short Circuit Arcing[J].IEEE transactions on components and packaging technologies: A publication of the IEEE Components, Packaging, and Manufacturing Technology Society,2004(1):51-56.
[21] 堵永国 .低电阻率Ag/SnO2电工触头材料及其制备[P].CN 1085346,1994-04-13.
[22] 王家真,王亚平,杨志懋,王伟,丁秉钧.CuO添加剂对Ag/SnO2润湿性与界面特性的影响[J].稀有金属材料与工程,2005(03):405-408.
[23] 张燕,王俊勃,杨敏鸽,丁秉钧,赵燕.添加La的纳米复合AgSnO2电接触合金的制备[J].低压电器,2006(03):6-10.
[24] 郑冀,高晶,李松林,李群英.新型银氧化锡电接触材料[J].稀有金属材料与工程,2005(03):483-485.
[25] 刘想梅 .纳米掺杂AgSnO<,2>电接触材料的研究[D].天津大学,2003.
[26] Wang Y;Ding B .The preparation and properties of microcrystalline and nanocrystalline CuCr contact materials[J].IEEE Trans on Components,1999,22(03):467.
[27] 王俊勃,李英民,王亚平,丁秉钧.纳米复合银基电触头材料的研究[J].稀有金属材料与工程,2004(11):1213-1217.
[28] 张尧卿,郑冀.AgSnO2电接触材料研究概述[J].材料导报,2006(04):53-57.
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