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采用直流反应磁控溅射方法,在铝基板上制备了AIN薄膜.利用X射线衍射仪、带能量色散谱仪的扫描电子显微镜、阻抗特性测试仪、椭圆偏振光谱仪、大荷载划痕仪等对薄膜特性进行测试,分析了不同溅射工艺条件对生长薄膜的影响.结果表明,获得了化学计量比一致、结合力良好、击穿场强达112V/μm的(100)多晶择优取向AIN薄膜.

参考文献

[1] Jennison DR.;Bogicevic A. .Ultrathin aluminum oxide films: Al-sublattice structure and the effect of substrate on ad-metal adhesion[J].Surface Science: A Journal Devoted to the Physics and Chemistry of Interfaces,2000(2/3):108-116.
[2] 孟献丰;朱宏 .AIN基板材料研究进展[J].陶瓷研究与职业教育,2003,1:41-45.
[3] Miyashiro F.;Iwase N. .High thermal conductivity aluminum nitride ceramic substrates and packages[J].IEEE transactions on components, hybrids, and manufacturing technology,1990(2):313-319.
[4] Ning X S;Nagata C;Sakuraba M et al.Process for preparing a ceramic',electronic circuit board and process for preparing aluminum or aluminum alloy bonded ceramic material[P].US 5965193,1999.
[5] 乔梁,周和平,王少洪.低温烧结AlN陶瓷的微结构和热导率[J].材料工程,2003(02):23-26.
[6] Fan Z Y;Rong G;Browning J et al.High temperature growth of A1N by plasma-enhanced molecular beam epitaxy[J].Materials Science and Engineering,1999,B67(12):80-87.
[7] Randriamora F;Bruyere J C;Deneuville A .Synthesis of AIN by reactive sputtering[J].Materials Science and Engineering,1997,B50(01):272-276.
[8] Khan A H;Messe J M;Stacy T et al.Electrical characterization of aluminum nitride films on silicon grown by chemical vapor deposition[J].Materials Research Society Symposium Proceedings,1994,339(05):637-642.
[9] Vispute R D;Wu H;Nazayan J .Epitaxial growth of AIN thin films on silicon (111) substrate by pulsed laser deposition[J].Applied Physics Letters,1995,67(27):4724-4728.
[10] Lavrenko V A;Desmaison J;Panasyuk A D et al.Corresion resistaneeofAIN-(TiB2-TiSi2) ceramics in air up to 1450℃[J].Journal of the European Ceramic Society,2003,23:357-369.
[11] Slack GA.;Schowalter LJ.;Morelli D.;Freitas JA. .Some effects of oxygen impurities on AlN and GaN[J].Journal of Crystal Growth,2002(3/4):287-298.
[12] Ansart F.;Saporte R.;Traverse JP.;Ganda H. .STUDY OF THE OXIDATION OF ALUMINIUM NITRIDE COATINGS AT HIGH TEMPERATURE[J].Thin Solid Films: An International Journal on the Science and Technology of Thin and Thick Films,1995(1):38-46.
[13] Chang J.H.;Duh J.G. .Morphology and adhesion strength in electroless Cu metallized AlN substrate[J].IEEE transactions on components, hybrids, and manufacturing technology,1993(8):1012-1020.
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