利用自行设计的超音速雾化制粉装置,研究了导液管突出高度对Sn3Ag2.8Cu无铅焊锡粉末有效雾化率、粒度分布、球形度及氧含量的影响.结果表明:在一定雾化条件下,导液管突出高度为4 mm,雾化粉末具有最佳球形度、表面光滑度及粒度分布,同时具有较高的有效雾化率和最低的氧含量;和Sn37Pb粉末相比,在与Cu基板的钎焊中,利用Sn3Ag2.8Cn粉末配制的焊锡膏与铜基板之间形成的IMC更厚,且更不规则;当导液管突出高度从4 mm增加至5 mm,粉末更细,有效雾化率提高,但粒度分布变差,粉末表面更粗糙;当导液管突出高度从4 mm减小至2 mm,粉末有效雾化率降低,粒度分布变差.因此,在本试验条件下,导液管突出高度最佳为4 mm.
The effects of the delivery tube protrusion height on efficient atomization efficiency,size distribution,sphericity and oxygen content of Sn3Ag2. 8Cu lead-free solder powder were investigated with a self-designed supersonic atomizer. The results show that the powder with uniform size distribution,smooth surface and high sphericity is obtained,and the higher efficient atomization efficiency and lower oxygen content for the powder is observed when protrusion height of delivery tube is 4. 0 mm. the thicker and more irregular the intermetallic compound (IMC) layers is observed in the joint prepared with Sn3Ag2. 8Cu powder and copper plate compared with that with Sn37Pb and copper plate. With protrusion height of delivery tube increasing from 4 mm to 5 mm,the prepared powder is finer and the efficient atomization efficiency increases,but the size distribution of the powder deteriorates,the powder surface becomes coarser and more irregular. With protrusion height of delivery tube decreasing frora 4 to 2 mm ,the efficient atomization efficiency is significantly decreased,and the size distribution of the powder deteriorates,its surface is coarser and more irregular. The optimal protrusion height of delivery tube is 4 mm under the experiment condition.
参考文献
| [1] | D.Q. Yu;J. Zhao;L. Wang .Improvement on the microstructure stability, mechanical and wetting properties of Sn-Ag-Cu lead-free solder with the addition of rare earth elements[J].Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics,2004(1/2):170-175. |
| [2] | Shiue RK.;Tsay LW.;Lin CL.;Ou JL. .A study of Sn-Bi-Ag-(In) lead-free solders[J].Journal of Materials Science,2003(6):1269-1279. |
| [3] | Kim Y S;Kim K S;Hwang C W et al.Effect of composition and cooling rate on microstructure and tensile properties of Sn-Zn-Bi alloya[J].Journal of Alloys and Compounds,2003,352(1-2):237-245. |
| [4] | Li DZ;Liu CQ;Conway PP .Characteristics of intermetallics and micromechanical properties during thermal ageing of Sn-Ag-Cu flip-chip solder interconnects[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2005(1/2):95-103. |
| [5] | Jeong-Won Yoon;Sang-Won Kim;Seung-Boo Jung .IMC morphology, interfacial reaction and joint reliability of Pb-free Sn-Ag-Cu solder on electrolytic Ni BGA substrate[J].Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics,2005(1/2):247-252. |
| [6] | O.D. Neikov;G.I. Vasilieva;A.V. Sameljuk;A.V. Krajnikov .Water atomised aluminium alloy powders[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2004(1):7-13. |
| [7] | S.-Y. Lee;T.-S. Kim;J.-K. Lee .Effect of powder size on the consolidation of gas atomized Cu_(54)Ni_6Zr_(22)Ti_(18) amorphous powders[J].Intermetallics,2006(8/9):1000-1004. |
| [8] | 赵麦群,赵高扬,于喜良,袁晓宇.无铅焊锡合金粉末超音速雾化技术的研究[J].粉末冶金技术,2003(02):96-98. |
| [9] | 许天旱,赵麦群,邸小波,李涛,刘阳,张文韬.过热度对无铅焊锡雾化粉末特性的影响[J].材料导报,2005(04):128-130. |
| [10] | ZHAO Xiao-yan,ZHAO Mai-qun,CUI Xiao-qing,XU Tian-han,TONG Ming-xin.Effect of cerium on microstructure and mechanical properties of Sn-Ag-Cu system lead-free solder alloys[J].中国有色金属学会会刊（英文版）,2007(04):805-810. |
| [11] | 孙剑飞,曹福洋,崔成松,沈军,李庆春.金属雾化过程中气体流场动力学行为[J].粉末冶金技术,2002(02):79-81. |
| [12] | 沈军;蒋祖龄;曾松岩 等.气体雾化过程的增压与吸动现象[J].粉末冶金技术,1994,12(01):15-17. |
| [13] | 陈文汨,万新华.喷嘴结构和工艺参数对雾化锌粉粒度的影响[J].中国有色金属学报,2001(05):852-857. |
| [14] | Anil V N;Gary L C;Aida V G et al.Powder metal pastes for brazing and aoldering applications[J].The Intemational Journal of Powder Metallurgy,2001,37(07):49-60. |
- 下载量()
- 访问量()
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%