用开路电位法、极化曲线法和电化学阻抗技术研究硫酸盐还原菌（SRB）对铜镍锡合金腐蚀行为的影响。用扫描电镜（SEM）和能谱分析（EDS）观察铜镍锡合金的腐蚀形貌。结果表明，SRB的存在使电极开路电位从-275 mV 负移至-750 mV，较无菌环境中开路电位（-100 mV）下降了650 mV，合金腐蚀加速。扫描电镜观察结果表明，合金表面生成不均匀的生物膜，主要发生点蚀和缝隙腐蚀。能谱分析显示腐蚀产物主要是铜和镍的硫化物，生物膜下铜镍锡合金发生脱镍和脱锡腐蚀。
The effect of sulfate - reducing bacteria (SRB) on corrosion behavior of Cu-Ni-Sn alloy were studied using open circuit potential, polarization curve and electrochemical impedance spectroscopy (EIS) methods. Scanning electron microscopy (SEM) and energy dispersive spectrometer (EDS) were utilized to investigate the corrosion morphologies of Cu-Ni-Sn alloy. The open circuit potential of the alloy in condition with SRB decreased from -275 mV to -750 mV and nearly 650 mV lower than that of which without SRB (-100 mV). SEM results showed that an uneven biofilm occurred on the alloy surface and there were pitting corrosion and crevice corrosion. EDS analysis indicates that denickelification and detinning corrosion occurred and the corrosion products were copper and nickel sulfide. Therefore, the corrosion of Cu-Ni-Sn alloy accelerated under the biofilm of SRB.
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