将银粉、有机载体和玻璃粉按一定比例混合制成导电银浆。银浆通过丝网印刷在硅基片上，保温烧结。采用SEM、四探针法研究银粉的不同粒径与形貌对银浆烧结厚膜层方阻的影响。结果表明，随着球形银粉粒径增大，银膜方阻先减小后增大，当球形银粉粒径在2μm时银膜方阻最小，为4.44?/□；当2μm片状银粉和2μm球形银粉混合加入时，银膜方阻最小，为3.95 m?/□；随着片银的含量增加，银膜方阻先减小后增大，当片状银粉为50%时银膜方阻最小，为3.92 m?/□。
The silver paste was prepared by mixing the glass frit, silver powder and organic vehicle with a certain proportion. The silver paste was printed on Si substrate by the way of silk screen printing and then sintered under a given temperature. The influence of particle size and morphology of silver powders on square resistance of Ag film was investigated by SEM and four probe method. The results showed that the silver film square resistance decrease first and then increase as the particle size of silver powder increase. The silver film square resistance reaches the minimum 4.44 m?/□ at the silver powder particle size of 2 μm. The silver film square resistance reaches the minimum 3.95 m?/□ when the 2 μm flake silver powder and 2 μm spherical silver powder are mixed added in. The silver film square resistance decrease first and then increase as the content of flake silver powder increase. The silver film square resistance reaches the minimum 3.92 m?/□ at the flake silver powder content of 50%.
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