为了进一步提高Ni-P镀层的耐蚀性能，在Ni-P化学镀液中加入硫酸铜制备了Ni-Cu-P三元合金化学镀层，测试了镀层的沉积速度，采用扫描电镜（SEM）观察了镀层的表面形貌，测试了镀层在5．0％H：sO。，5．0％NaOH及3．5％NaCl溶液中的动电位极化曲线，并与Ni-P化学镀层进行了比较。结果表明：Ni-Cu-P镀层表面的胞状物比Ni-P镀层的更加细小，镀层致密性更好；Ni-Cu-P镀层在3种介质中均表现出更好的耐均匀腐蚀性和抗点蚀性能，主要是因为Ni-Cu-P镀层的非晶态结构减少了镀层缺陷数量，从而减少了腐蚀发生的敏感位置和腐蚀微电池的数量，同时更加细小的晶粒也使Ni-Cu-P镀层比Ni-P镀层更容易钝化和维持钝态，另外Ni-Cu-P镀层更为致密也减少了腐蚀介质渗入基体的通道。
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