测试了不同溅射偏压下Cu膜的纳米压入硬度,探讨了溅射偏压、残余应力及压痕尺寸效应对Cu膜硬度的影响.结果表明,随着溅射偏压的增大,薄膜晶粒尺寸及残余压应力均减小,导致薄膜的硬度增大,并在-80V达到最大值,随后有所降低.同时薄膜中的压痕尺寸效应对薄膜硬度随压入深度的分布有很大的影响.
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