采用非平衡反应磁控溅射的方法在Si(100)基片上沉积Ti(C,N)复合膜和不同调制周期、调制比的TiN/Ti(C,N)纳米多层薄膜.薄膜的微观结构和力学性能采用X射线衍射仪(XRD)、显微硬度计进行表征.结果表明,Ti(C,N)复合膜的微观结构和力学性能与掺入C的含量有关;TiN/Ti(C,N)纳米多层膜的微观结构和力学性能与调制周期和调制比有关,其显微硬度在一定的调制周期和调制比范围内出现了超硬现象.Ti(C,N)、TiN/Ti(C,N)均为δ-NaCl面心立方结构;Ti(C,N)复合膜显微硬度提高是因为固溶强化,TiN/Ti(C,N)纳米多层膜硬度的提高主要是共格外延生长在界面处产生的交变应力场.
Ti(C,N) and TiN/Ti(C,N) multilayer films were deposited on (100) silicon suhstrates by unbalanced magnetron (UMB) sputtering process. The films were characterized by X-ray diffraction (XRD) and micro-hardness test. The results show that the lattice parameters of Ti (C,N) film gradually increase and its microhardness first increases and then decreases with the increase of carbon content,the preferred orientiation of TiN/Ti (C,N) multilayer film depends on modulation period and thickness ratio of TiN film to Ti (C,N) film and microhardness of the films is enhanced in a modulation of 6～8 nm and Ti (C,N) thickness of 1～2 nm. Ti(C,N) and TiN/Ti(C,N) films are both of δ-NaCl structure. The microhardness increasing of Ti (C,N) thin films is because of solid solution. The strengthening of the multilayer films is due to the alternating stress field resulted from coherent strain of the interface between TiN and Ti (C,N) films.
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