采用循环极化测试和电化学阻抗谱测试,考察分析了不同晶粒度在不同溶液中对铜点蚀行为的影响.利用光学显微镜、扫描电镜和电化学工作站对不同晶粒度的铜试样在三种溶液中的腐蚀形貌和电化学性能进行表征和测量.结果表明,在含SO42-/HCO3-的溶液体系中铜发生活性溶解型点蚀,且点蚀敏感性随晶粒度减小而增加;在含OH-的碱性环境中,晶粒度减小将促进铜快速形成具有保护性的钝化膜层;SO42将导致铜在OH-碱性环境中发生钝化膜破裂型点蚀,其点蚀敏感性随晶粒度减小而降低.
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