对采用多孔微热沉的大功率LED阵列主动散热方案进行散热分析,系统采用一个微泵驱动,依靠封闭多孔微热沉系统实现大功率LED阵列的高效散热.数值分析表明:在没有采用多孔微热沉而仅依靠冷却工质散热的情况下,芯片最高温度为87℃,采用上述冷却方案后,芯片温度大幅度降低,系统散热效果明显改善.并且孔隙率和工质入口流速都对系统换热有很大的影响.研究结果表明多孔微热沉系统可以有效解决大功率LED阵列散热问题,提高LED芯片的寿命和性能.
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