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  4. Research Progress in Solderable Black Pad of Electroless Nickel/Immersion Gold

稀土学报(英文版), 2007, 25(z1): 308-312.

1, , 2, , 3, , 4,

1.Department of Applied Chemistry, Harbin Institute of Technology, Harbin 150001, China

2.Department of Applied Chemistry, Harbin Institute of Technology, Harbin 150001, China

3.Department of Applied Chemistry, Harbin Institute of Technology, Harbin 150001, China

4.Department of Applied Chemistry, Harbin Institute of Technology, Harbin 150001, China

基金项目:   教育部高等学校博士学科点专项科研基金(20030213007)   黑龙江省自然科学基金(E0325)  

Research Progress in Solderable Black Pad of Electroless Nickel/Immersion Gold

Liu Haiping 1, , Li Ning 2, , Bi Sifu 3, , Li Deyu 4,

1.Department of Applied Chemistry, Harbin Institute of Technology, Harbin 150001, China

2.Department of Applied Chemistry, Harbin Institute of Technology, Harbin 150001, China

3.Department of Applied Chemistry, Harbin Institute of Technology, Harbin 150001, China

4.Department of Applied Chemistry, Harbin Institute of Technology, Harbin 150001, China

Keywords： electroless nickel

Electroless nickel/immersion gold (ENIG) technology is widely used as one of the surface final finish for electronics packaging substrate and printed circuit board (PCB), providing a protective, conductive and solderable surface. However, there is a solder joint interfacial brittle fracture (or solderability failure) of using the ENIG coating. The characteristics and the application of ENIG technology were narrated in this paper. The research progress on the solderability failure of ENIG was introduced. The mechanism of "black pad" and the possible measure of eliminating or alleviating the "black pad" were also introduced. The development direction and market prospects of ENIG were prospected.

参考文献

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