选用低 Cl~-、低 SO_4~(2-)浓度—高 HCO_3~-浓度的混合溶液,用电化学方法及表面分析技术研究了磷脱氧铜(TUP)的阳极极化行为及孔蚀引发和扩发过程。结果表明,铜在所用混合溶液中呈现典型的孔蚀特征;铜孔蚀的引发是由于 Cl~-进入表面膜并迁移到金属膜界面而导致局部破坏;铜孔蚀扩展的主要过程是 CuCl 的形成并水解,导致低 pH 值,并有 Cl~-浓集;铜的孔蚀具有自催化效应.
The anodic polarization behaviour and the initiation and propagation processes of pitting corrosion of TUP copper have been studied by electro- chemical method and surface analysis technique in mixed solution of low Cl~- and SO_4~(2-) but high HCO_3~- concentrations.Copper shows typical pitting characteristics in this mixed solution.The initiation of pitting corrosion of copper is due to Cl~- ions entering surface film and migrating to metal/ film interface,resulting in local breakdown of film.The main process of pitting propagation of copper is the formation and hydrolysis of CuCl, resulting in low pH value and Cl~- enrichment with autocatalytic effect in pitting process.
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