采用非平衡分子动力学(NEME)方法及Tersoff势能函数模拟了微尺度下空位结构缺陷对单晶硅薄膜热导率的影响.结果表明,硅薄膜的热导率随空位浓度的增加而明显减小.当温度为300~700K时,随着温度的升高,空位浓度对热导率的影响以及同一空位浓度下温度对热导率的影响都逐渐减弱.
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