为改善亚乙基降冰片烯（ENB）自修复微胶囊在环氧树脂（Epoxy）中的分散性，采用KH560偶联剂对ENB微胶囊表面进行处理，探讨KH560改性ENB微胶囊（KH560-ENB）在Epoxy材料中的分散性及KH560-ENB环氧树脂材料（KH560-ENB／Epoxy）的拉伸性能。结果表明：对未改性的ENB微胶囊树脂复合材料（ENB／Epoxy），当ENB微胶囊与Epoxy质量比小于或等于5％时，ENB／Epoxy的拉伸断裂强度、拉伸模量以及断裂伸长率均随ENB微胶囊与Epoxy质量比的增加而降低，但经不同温度预固化后，ENB／Epoxy复合材料拉伸指标初始下降速率均不同；KH560-ENB微胶囊在Epoxy中累积分布线性拟合相关系数为0．9945，接近于1，说明KH560-ENB微胶囊在Epoxy中分散性好，且KH560-ENB／Epoxy复合材料的拉伸断裂强度提高19．1％，拉伸模量提高6．6％；对KH560-ENB／Epoxy复合材料的SEM断面观察结果表明，KH560-ENB微胶囊与Epoxy界面粘接良好。
In order to improve the dispersion of ethylidene - 2 - norbornene （ENB） based self - healing microcapsules in the epoxy, KH560 coupling agent was chosen to modify the surface of ENB microeapsules. The dispersion of KH560 - ENB microcapsules and their influence on tensile property of KH560 - ENB/Epoxy composites were studied. The results show that, the tensile fracture strength, tensile modulus and elongation at break of ENB/Epoxy composites, decrease when the mass ratio of ENB microcapsules to epoxy increases to no more than 5~. The falling slopes of those three tensile properties vary with pre-curing temperature for ENB/Epoxy composites. The linear coefficient of cumulative distribution of KH560 - ENB microcapsule in epoxy is 0. 9945, nearly to 1, showing better dispersion. Furthermore, tensile fracture strength and tensile modulus of KH560 - ENB/Epoxy composites increase by 19.1% and 6.6%, respectively. According to SEM observations of KH560 - ENB/Epoxy cross section, the interface between KH560 - ENB microcapsules and epoxy is well bonded.
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