焦磷酸盐电镀Cu—sn合金是替代氰化物镀Cu-Sn合金的最重要电镀工艺，但是它的最大缺点是电沉积速度慢、镀层耐腐蚀性差。本工作采用电化学方法和失重腐蚀试验，研究了添加剂对焦磷酸盐电镀Cu-Sn合金的电沉积速度、失重腐蚀速度、腐蚀电流密度等的影响。结果表明，焦磷酸盐电镀Cu-Sn合金的最佳添加剂是光亮剂乙二胺（EDA，0．5g／L）、辅助光亮剂甲醛（HCHO，0．5g／L）与表面张力处理剂（SDBS，0．5g／L）三者的复合。
Electroplating of Cu-Sn alloy coating in pyrophosphate bath is the most important electroplating process which can substitute Cu-Sn cyanide electroplating, but the biggest shortcoming of it is slow deposition rate and poor anti-corrosion properties of Cu-Sn alloy coating. The influence of additives on the properties of Cu-Sn coating was studied by electrochemical and weight-loss methods. The results showed that the optimal additives of pyrophosphate Cu-Sn electroplating are 0. 5 g/L ethylenediamine （brightener）, 0.5 g/L HCHO （auxiliary brightener） and 0.5 g/L SDBS （surfactant）.
参考文献
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