采用γ-氨丙基三乙氧基硅烷(KH-550)对硅微粉、气相SiO2进行表面改性后，分别使用单一的硅微粉、气相SiO2及复配的硅微粉/气相SiO2作为填料，对环氧树脂电子灌封胶进行改性，制得二元或三元体系的复合材料，并对其力学性能进行比较分析。结果表明：与采用单一填料改性的二元体系相比，采用硅微粉和气相SiO2组合填料改性的三元体系环氧复合材料的力学性能较好；当m(环氧树脂)∶m(硅微粉)∶m(气相SiO2)=100∶120∶3时，复合材料的弯曲强度达到最大值161.44 MPa。
The silicon powder and aerosil were modified by γ-Aminopropyltriethoxysilane (KH-550). The silicon powder, aerosil, and silicon powder/aerosil were used as filler to modify epoxy resin pouring seal-ant respectively, and two binary systems and a ternary system composite was prepared, and their mechani-cal properties were analyzed. The results show that the mechanical properties of the ternary system ep-oxy composite filled by silicon powder/aerosil are better. When the mass ratio among eopxy resin, silicon powder, and aerosil is 100∶120∶3, the bending strength attains maximum, which is 161.44 MPa.
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