以石墨、铜粉、铝粉三种导热填料填充到环氧树脂中制备导热胶粘剂，采用SEM和金相显微镜对材料进行形貌表征，采用TPS2500导热系数测定仪测试样品的导热系数。研究了这三种类型导热填料在不同填充量时的热导性能的变化规律，并对比讨论了三种填料在最大填充比例时胶粘剂的导热系数。
Three kinds of thermal conductivity adhesives were prepared by epoxy resin (E-44) with graphite, copper powder and aluminum powder. The morphology of three kind fillers were examined by scanning electron microscopy (SEM) and metallurgic microscope. The thermal conductivities of all the samples were tested by Hotdisk TPS-2500 thermal conductivity tester. The thermal performance of adhesives with the three fillers in different contents was investigated, and the thermal conductivity coefficient of adhesives with the three kind of thermal filler's with the same content epoxy resin(mass ratio=1:1.2) and with the highest content was compared and discussed.
参考文献
| [1] | Yang, LY;Niu, R;Xie, JS;Qian, B;Song, BS;Rong, QG;Bernstein, J .Design-for-reliability implementation in microelectronics packaging development[J].Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe,2011(1):29-40. |
| [2] | Optimal placement of heat generating components at various levels of electronics packaging[J].Microelectronics journal,2010(2/3):129. |
| [3] | Jiao J;Sun X;Pinnavaia TJ .Reinforcement of a rubbery epoxy polymer by mesostructured silica and organosilica with wormhole framework structures[J].Advanced functional materials,2008(7):1067-1074. |
| [4] | W. Sun Lee;J. Yu .Comparative study of thermally conductive fillers in underfill for the electronic components[J].Diamond and Related Materials,2005(10):1647-1653. |
| [5] | 储九荣,张晓辉,徐传骧.导热高分子材料的研究与应用[J].高分子材料科学与工程,2000(04):17-21. |
| [6] | Novak I;Krupa I .Electro-conductive resins filled with graphite for casting applications[J].European Polymer Journal,2004(7):1417-1422. |
| [7] | MYUNG JIN YIM;YI LI;KYOUNG SIK MOON;C.P. WONG .Oxidation Prevention and Electrical Property Enhancement of Copper-Filled Isotropically Conductive Adhesives[J].Journal of Electronic Materials,2007(10):1341-1347. |
| [8] | Arranz A.;Palacio C. .CHARACTERIZATION OF THE SURFACE AND INTERFACE SPECIES FORMED DURING THE OXIDATION OF ALUMINUM[J].Surface Science: A Journal Devoted to the Physics and Chemistry of Interfaces,1996(1/3):203-213. |
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