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  4. CSD制备涂层导体缓冲层的技术进展

材料导报, 2009, 23(19): 1-6.

CSD制备涂层导体缓冲层的技术进展

王耀 1, , 周廉 2, , 卢亚锋 3, , 李成山 4, , 于泽铭 5, , 李金山 6,

1.西北工业大学凝固技术国家重点实验室,西安710072

2.西北工业大学凝固技术国家重点实验室,西安710072;西北有色金属研究院,西安710016

3.西北有色金属研究院,西安710016

4.西北有色金属研究院,西安710016

5.西北有色金属研究院,西安710016

6.西北工业大学凝固技术国家重点实验室,西安710072

基金项目:   国家自然科学基金(50872115)  

关键词： 高温超导 , 涂层导体 , 缓冲层 , 化学溶液沉积

Progress of CSD-buffer Layers for Coated Conductors

化学溶液沉积(CSD)技术在制备高温超导涂层导体方面具有易操作和低成本的优点.简述了CSD技术的基本原理以及在不同结构缓冲层制备方面的应用,并展望了涂层导体缓冲层技术的发展趋势.

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