研究了固溶时效和快速凝固时效工艺对Cu-Cr-Zr-Mg合金的显微组织、硬度和导电率性能的影响.结果表明快速凝固态晶粒比固溶态晶粒细小得多,细晶强化作用显著.合金经920℃×1h固溶和550℃×0.5h时效后,硬度为100HV,导电率这71%IACS;快速凝固和同样的时效条件下,硬度为126HV,导电率达70%IACS.
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