采用背光级数、SEM及能谱分析等方法研究了阳离子表面活性剂聚季铵盐对印制线路板(PCB)碱性除油工艺的影响.结果表明,不加聚季铵盐时,碱性除油后,PCB孔壁镀层裸露出较多的玻璃纤维基材,镀层漏光现象严重,背光级数仅为6级.随聚季铵盐加入量增大,PCB孔壁背光级数及化学镀速均先增大后减小,当浓度为13.5 mL/L时,孔壁镀层鲜见玻璃纤维,背光实验几乎不透光,级数高达10级.聚季铵盐主要作用为将PCB基体调整为荷正电,以促进后续胶体钯活性粒子的吸附,同时吸附在油/溶液界面上,降低界面张力,加强碱液对PCB孔壁的润湿性,此外,它还是OH-的主要提供者,实现去除PCB孔壁油污的作用.
参考文献
| [1] | Chiang Y Y,Wang Y Y,Wan C C.Research on applying direct plating to additive process for printed circuit board[J].J.Electron.Mater.,2000,29(8):1001 |
| [2] | Gattrell M,MacDougall B,Henuset Y M,et al.An electrochemical approach to total organic carbon control in printed circuit board copper sulfate plating baths[J].J.Appl.Electrochem.,2002,32(12):1303 |
| [3] | Leung E S W,Yung W K C,Lee W B.A study of microvias produced by laser-assisted seeding mechanism in blind via hole plating of printed circuit board[J].Int.J.Adv.Manuf.Teclmol.,2004,24(7-8):474 |
| [4] | Shacham D Y,Osaka T,Datta M,et al.Advanced Nanoscale ULSI Interconnects:Fundamentals and Applications[M].New York,USA:Springer-Verlag New York Inc,2009 |
| [5] | 王鸿显,赵红坤.甘油铜络合物溶液化学镀铜的研究[J].腐蚀科学与防护技术,2007,19(3):178 |
| [6] | 金鸿,陈森.印制电路技术[M].北京:化学工业出版社,2003 |
| [7] | Huttunen E,Tiainen T.Optimization of the preplating processes in the fabrication of electrolessly tin-coated copper tube[J].J.Mater.Eng.Perform.,2001,10(2):157 |
| [8] | Xiao F X,Shen X N,Niu F.A high speed electroless copper plating process of printed circuit board fiom EDTA-2Na-Containing solution[A].TMS 2010-139th Annual Meeting and Exhibition-Supplemental Proceedings[C].Seattle,WA,USA,2010:671 |
| [9] | 申晓妮,赵冬梅,任凤章等.添加剂对四羟丙基乙二胺(THPED)化学镀厚铜的影响[J].中国腐蚀与防护学报,2011,31(5):362 |
| [10] | Zheng Y J,Xiao F X,Yi D Q,et al.Preparation of salt-based colloid palladium of high concentration[J].Trans.Nonferrous Met.Soc.China,2005,15(1):190 |
| [11] | 肖发新.新型盐基胶体钯制备及应用[D1.长沙:中南大学,2005 |
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