用XRD定量法分析了W的共沉积对Ni-P基合金镀层热处理晶化程度、晶粒尺寸的影响,通过镀层硬度测试、干摩擦条件下的磨损实验以及SEM形貌观察研究了镀层的磨损行为.结果表明:W的共沉积提高了镀态和热处理的Ni-W-P镀层的晶化程度,加速Ni相的晶化过程,提高了Ni3P相的晶化反应温度,并使Ni-W-P镀层硬度大于Ni-P镀层的硬度.非晶态Ni-9.27%P镀层晶化前后的磨损行为主要表现为粘着磨损;当P含量与其相同(相近)时,W的加入不改变Ni-5.13%W-9.32%P合金在镀态及低温热处理时的粘着磨损行为,但对高温(600 ℃以上)热处理镀层起主导作用的磨损形式为微切削磨损机制.
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