印刷线线路板(PCB)孔壁化学镀铜金属化前的碱性除油处理,有利于调整其电荷和后期的催化化学镀铜反应。采用背光级数、SEM及EDS等方法研究了碱性除油液中OP-10乳化剂浓度对PCB孔壁化学镀铜性能的影响。结果表明,OP-10浓度对PCB的碱性除油有显著影响:不加OP-10,PCB孔壁化学铜镀后基材裸露较多,漏光现象严重,背光级数仅为6级;随OP-10浓度的增大,PCB孔壁镀铜层的背光级数及镀速均先增大后减小,当其为2.5mL/L时,镀铜层几乎全部覆盖基体,背光级数高达9.5级;OP-10的主要作用是吸附在油污与溶液界面处,降低界面张力,加强碱液对PCB孔壁的润湿,去除其上的油污,确保后续化学镀铜的成功。
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