以碳化硅为原料,通过调整骨料粒径等级,并添加造孔剂和粘结剂,制备了孔隙率在35%~45%,平均孔径为40~60 μm,具有狭窄的孔径分布(PSD)和很高强度的用于无机分离膜的微米级多孔陶瓷材料.在一定的烧成温度下,多孔陶瓷的平均气孔孔径与平均骨料粒径成正比.随着保温时间的延长,气孔孔径趋向均一;平均孔径增大,PSD变窄.增加粘结剂用量有利于促进PSD的集中趋势.多孔陶瓷的强度取决于骨料颗粒间的颈部连接强度,并随粘结剂用量的增加和烧成温度的提高而上升.
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