利用ANSYS有限元分析软件对石墨/铜机械连接传热效果、适配层对钨/铜第一壁材料界面行为改善及结构优化进行研究.结果显示,除螺钉固定区域外,石墨/铜两种机械连接方式能够承受4 MW/m2的热负荷作用.但是对于较高的热负荷区域,机械连接是不适合的.适配层的引入能有效降低钨/铜界面的热应力集中,特别是钨/铜适配层,而对温度抬高较小.0.1～0.2 mm、20％～30％W/Cu(体积分数)是1 mm钨涂层最佳的适配层结构,能有效降低表面热应力(高达24％).
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