综述了功能填料高填充聚合物基复合材料(HFPCs)在埋入式器件、高能存储、导热、封装等方面的应用情况,探讨了不同因素对HFPCs介电强度的影响及其研究进展,并对该材料的应用前景进行了展望。
The application situation of polymer composites high-filled by functional filler (HFPCs) in em-bedded devices, high energy storage, conductive and IC package was reviewed. The effects of various fac-tors on the dielectric strength of the HFPCs and its research progress were discussed, and the application prospect of the HFPCs was proposed.
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